Eric Solecky
Process Engineer at GlobalFoundries
SPIE Involvement:
Conference Program Committee | Author | Instructor
Publications (32)

PROCEEDINGS ARTICLE | March 22, 2018
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Metrology, Fin field effect transistors, X-rays, Silicon, Image resolution, Scanning electron microscopy, 3D metrology, Process control, Critical dimension metrology, Overlay metrology

PROCEEDINGS ARTICLE | March 28, 2017
Proc. SPIE. 10145, Metrology, Inspection, and Process Control for Microlithography XXXI
KEYWORDS: Semiconductors, Signal to noise ratio, Metrology, Logic, X-rays, Silicon, Inspection, Image resolution, Scanning electron microscopy, Signal processing, 3D metrology, High volume manufacturing, Critical dimension metrology, Overlay metrology, Nanowires

PROCEEDINGS ARTICLE | March 28, 2017
Proc. SPIE. 10145, Metrology, Inspection, and Process Control for Microlithography XXXI
KEYWORDS: Electron beam lithography, Metrology, Optical lithography, Image processing, Manufacturing, Inspection, Image resolution, Scanning electron microscopy, Process control, Dimensional metrology, Critical dimension metrology, Semiconducting wafers, Overlay metrology, Defect inspection


PROCEEDINGS ARTICLE | March 19, 2015
Proc. SPIE. 9424, Metrology, Inspection, and Process Control for Microlithography XXIX
KEYWORDS: Metrology, Image segmentation, Atomic force microscopy, Optical testing, Scanning electron microscopy, 3D metrology, Critical dimension metrology, Semiconducting wafers, Overlay metrology, Back end of line

SPIE Journal Paper | December 19, 2014
JM3 Vol. 13 Issue 04
KEYWORDS: Metrology, Overlay metrology, Manufacturing, Roads, Etching, Scanning electron microscopy, Scatterometry, Semiconducting wafers, Germanium, Microelectronics

Showing 5 of 32 publications
Conference Committee Involvement (6)
Metrology, Inspection, and Process Control for Microlithography XXXIII
25 February 2019 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXII
26 February 2018 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXI
27 February 2017 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXX
22 February 2016 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXIX
23 February 2015 | San Jose, California, United States
Showing 5 of 6 published special sections
Course Instructor
SC1133: Advanced concepts in Metrology Toolset Stability and Matching
The course covers advanced concepts for metrology toolset stability and matching. It will cover many critical topics that together maximize fleet performance. This is especially important given the shift to new device architectures (finfet, 3D Flash, DRAM and advanced memory ) that are challenging metrology toolsets in ways not seen before. A number of advanced concepts will be covered. Review best known methods for gauge study analysis and metrics. Appropriately setting up tool control chart limits for long term stability fleet matching based on requirements not historical data. Leveraging real time normalized product data to decrease Mean Time To Detect (MTTD) tool drifts. Recipe portability matching and monitoring to catch other issues that will affect lot cycletime. The concepts discussed are applicable to any metrology toolset such as CD-SEM, overlay, thin film, AFM, etc. and most of these concepts are also applicable to defect toolsets.
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