Electron microscopy, along with many other surface science and analytical techniques, offers an array of complementary
sub-techniques that provide additional information to enhance the primary analysis or imaging mode. Most electron
microscopes are built with several additional ports for the installation of complementary analysis modules. One type of
analysis which is particular useful in geology and semiconductor analysis is cathodoluminescence (CL).
A new technique has been developed to allow complementary optical measurements using the electron beam from the
SEM, compatible with most standard commercial SEM systems. Among the optical measurements accessible using the
Cathodoluminescence Universal Extension (CLUE) module are CL, Raman, PL and EDX spectroscopy and imaging.
This paper shows the advantages of using these complementary techniques, and how they can be applied to analysis of
geological and semiconductor materials.
Due to they can be tailored to provide a wide range of physical properties and their easiness of processing and fabrication, polymeric materials have found widespread use in the manufacture of microwave, electronics, photonics and bio-tech systems. This paper presents the basic principle of phase modulation spectroscopic ellipsometer (PMSE) and its advantages over other ellipsometry in measuring polymer film. Used for thin film measurements ultra-thin dielectric, meal film and organic film, the PMSE technique is now used over a wide spectral range from the vacuum ultraviolet to the mid infrared. Film thickness ranging from Angstrom up to 50um can be measured by PMSE. Applications of PMSE on measurement and characterization of polymer/organic material are given in the paper.
A New Polarimetric method for trench depth monitoring in micromachining applications is presented. As compared to the previous innovative and patented Twin-Spot interferometric technique developed by the Thin Film Division of Jobin Yvon, this new method allows an absolute and accurate trench depth monitoring suitable for Bosch process with no external triggering.