Eusebio Carasusán Perez
Telecommunications Engineer at Univ Politècnica de Catalunya
SPIE Involvement:
Author
Publications (2)

PROCEEDINGS ARTICLE | December 16, 2004
Proc. SPIE. 5606, Two- and Three-Dimensional Vision Systems for Inspection, Control, and Metrology II
KEYWORDS: Optical components, 3D acquisition, Metals, Error analysis, Laser marking, Clouds, 3D metrology, Projection systems, Strain analysis, 3D image processing

PROCEEDINGS ARTICLE | May 22, 2003
Proc. SPIE. 5011, Machine Vision Applications in Industrial Inspection XI
KEYWORDS: Visualization, Metals, Photography, Laser engraving, Optical testing, 3D metrology, Algorithm development, C++, Optics manufacturing, 3D image processing

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