Dr. Frederic Lazzarino
at IMEC
SPIE Involvement:
Author
Publications (17)

PROCEEDINGS ARTICLE | April 17, 2018
Proc. SPIE. 10589, Advanced Etch Technology for Nanopatterning VII
KEYWORDS: Carbon, Lithography, Etching, Chemistry, Scanning electron microscopy, Photoresist materials, Line width roughness, Plasma enhanced chemical vapor deposition, Extreme ultraviolet lithography, Line edge roughness

PROCEEDINGS ARTICLE | March 30, 2018
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Image processing, Materials processing, Image acquisition, Scanning electron microscopy, Image filtering, Extreme ultraviolet, Line width roughness, Double patterning technology, Line edge roughness, Material characterization

PROCEEDINGS ARTICLE | March 20, 2018
Proc. SPIE. 10589, Advanced Etch Technology for Nanopatterning VII
KEYWORDS: Oxides, Etching, Metals, Dielectrics, Scanning electron microscopy, Photoresist materials, Line edge roughness

PROCEEDINGS ARTICLE | March 20, 2018
Proc. SPIE. 10589, Advanced Etch Technology for Nanopatterning VII
KEYWORDS: Semiconductors, Optical lithography, Metals, Scanning electron microscopy, Photoresist materials, Extreme ultraviolet, Extreme ultraviolet lithography, High volume manufacturing, Line edge roughness, Back end of line

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10583, Extreme Ultraviolet (EUV) Lithography IX
KEYWORDS: Lithography, Optical lithography, Etching, Metals, Resistance, Printing, Monte Carlo methods, Process control, Critical dimension metrology, Dielectric breakdown

PROCEEDINGS ARTICLE | April 7, 2017
Proc. SPIE. 10149, Advanced Etch Technology for Nanopatterning VI
KEYWORDS: Amorphous silicon, Semiconductors, Lithography, Optical lithography, Silica, Etching, Metals, Coating, Materials processing, Photomasks, Extreme ultraviolet, Double patterning technology, High volume manufacturing, System on a chip, Standards development, Tin

Showing 5 of 17 publications
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