Dr. Frederic Lazzarino
at IMEC
SPIE Involvement:
Author
Publications (12)

PROCEEDINGS ARTICLE | April 7, 2017
Proc. SPIE. 10149, Advanced Etch Technology for Nanopatterning VI
KEYWORDS: Amorphous silicon, Semiconductors, Lithography, Optical lithography, Silica, Etching, Metals, Coating, Materials processing, Photomasks, Extreme ultraviolet, Double patterning technology, High volume manufacturing, System on a chip, Standards development, Tin

PROCEEDINGS ARTICLE | March 27, 2017
Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV
KEYWORDS: Oxides, Optical lithography, Etching, Metals, Photoresist materials, Extreme ultraviolet lithography, Photoresist processing, System on a chip, Plasma, Tin

PROCEEDINGS ARTICLE | March 27, 2017
Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV
KEYWORDS: Semiconductors, FT-IR spectroscopy, Optical lithography, Argon, Metals, Chemistry, Surface roughness, Photoresist materials, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Double patterning technology, High volume manufacturing, Line edge roughness, Semiconducting wafers, Plasma, Back end of line

PROCEEDINGS ARTICLE | March 24, 2017
Proc. SPIE. 10143, Extreme Ultraviolet (EUV) Lithography VIII
KEYWORDS: Lithography, Optical lithography, Contamination, Etching, Metals, Scanners, Photoresist materials, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Photoresist processing, Semiconducting wafers, Photoresist developing, Absorption

PROCEEDINGS ARTICLE | March 24, 2017
Proc. SPIE. 10143, Extreme Ultraviolet (EUV) Lithography VIII
KEYWORDS: Lithography, Logic, Optical lithography, Etching, Metals, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Double patterning technology, Critical dimension metrology, Semiconducting wafers, Stochastic processes, System on a chip, Back end of line

PROCEEDINGS ARTICLE | March 24, 2017
Proc. SPIE. 10143, Extreme Ultraviolet (EUV) Lithography VIII
KEYWORDS: Logic, Optical lithography, Etching, Metals, Extreme ultraviolet, Extreme ultraviolet lithography, Critical dimension metrology, Semiconducting wafers, Tin, Back end of line

Showing 5 of 12 publications
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