Feifei Feng
at Focuslight Technologies Inc
SPIE Involvement:
Author
Publications (3)

PROCEEDINGS ARTICLE | February 20, 2015
Proc. SPIE. 9346, Components and Packaging for Laser Systems
KEYWORDS: Packaging, Indium, Reliability, Laser applications, Laser welding, Semiconductor lasers, High power diode lasers, Heatsinks, Laser bonding, Liquids

PROCEEDINGS ARTICLE | February 20, 2015
Proc. SPIE. 9346, Components and Packaging for Laser Systems
KEYWORDS: Packaging, Continuous wave operation, Polarization, Copper, Indium, Reliability, Fiber lasers, Semiconductor lasers, High power diode lasers, Heatsinks

PROCEEDINGS ARTICLE | February 3, 2015
Proc. SPIE. 9255, XX International Symposium on High-Power Laser Systems and Applications 2014
KEYWORDS: Packaging, Copper, Indium, Reliability, Laser development, Semiconductor lasers, Optical simulations, High power diode lasers, Heatsinks, Laser bonding

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