Dr. Felix Holzner Profile

Dr. Felix Holzner

CEO at SwissLitho AG

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Publications (4)

Proceedings Article | 19 March 2018 Paper

Single-nanometer accurate 3D nanoimprint lithography with master templates fabricated by NanoFrazor lithography

T. Kulmala, C. Rawlings, M. Spieser, T. Glinsner, A. Schleunitz, F. Bullerjahn, F. Holzner

Proc. SPIE. 10584, Novel Patterning Technologies 2018

KEYWORDS: Lithography, Holograms, Etching, Polymers, Silicon, Scanning probe lithography, Atomic force microscopy, Nanoimprint lithography, Reactive ion etching, Photoresist processing

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Proceedings Article | 21 March 2016 Paper

PVD prepared molecular glass resists for scanning probe lithography

Christian Neuber, Hans-Werner Schmidt, Peter Strohriegl, Daniel Wagner, Felix Krohn, Andreas Schedl, Simon Bonanni, Felix Holzner, Colin Rawlings, Urs Dürig, Armin Knoll

Proc. SPIE. 9779, Advances in Patterning Materials and Processes XXXIII

KEYWORDS: Thin films, Lithography, Optical lithography, Silica, Etching, Polymers, Molecules, Crystals, Silicon, Resistance, Scanning probe lithography, Photoresist materials, Physical vapor deposition

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Proceedings Article | 28 March 2014 Paper

Closed-loop high-speed 3D thermal probe nanolithography

A. Knoll, M. Zientek, L. Cheong, C. Rawlings, P. Paul, F. Holzner, J. Hedrick, D. Coady, R. Allen, U. Dürig

Proc. SPIE. 9049, Alternative Lithographic Technologies VI

KEYWORDS: Lithography, Optical lithography, Polymers, Molecules, Silicon, Image resolution, Scanning probe lithography, Scanning electron microscopy, Photomasks, Nanolithography

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Thermal Scanning Probe Lithography (tSPL) is an AFM based patterning technique, which uses heated tips to locally evaporate organic resists such as molecular glasses [1] or thermally sensitive polymers.[2][3] Organic resists offer the versatility of the lithography process known from the CMOS environment and simultaneously ensure a highly stable and low wear tip-sample contact due to the soft nature of the resists. Patterning quality is excellent up to a resolution of sub 15 nm,[1] at linear speeds of up to 20 mm/s and pixel rates of up to 500 kHz.[4] The patterning depth is proportional to the applied force which allows for the creation of 3-D profiles in a single patterning run.[2] In addition, non-destructive imaging can be done at pixel rates of more than 500 kHz.[4] If the thermal stimulus for writing the pattern is switched off the same tip can be used to record the written topography with Angstrom depth resolution. We utilize this unique feature of SPL to implement an efficient control system for reliable patterning at high speed and high resolution. We combine the writing and imaging process in a single raster scan of the surface. In this closed loop lithography (CLL) approach, we use the acquired data to optimize the writing parameters on the fly. Excellent control is in particular important for an accurate reproduction of complex 3D patterns. These novel patterning capabilities are equally important for a high quality transfer of two-dimensional patterns into the underlying substrate. We utilize an only 3-4 nm thick SiOx hardmask to amplify the 8±0.5 nm deep patterns created by tSPL into a 50 nm thick transfer polymer. The structures in the transfer polymer can be used to create metallic lines by a lift-off process or to further process the pattern into the substrate. Here we demonstrate the fabrication of 27 nm wide lines and trenches 60 nm deep into the Silicon substrate.[5] In addition, the combined read and write approach ensures that the lateral offset between read and write field is minimized. Thus we achieve high precision in marker-less stitching of patterning fields. A 2D cross-correlation technique is used to determine the offset of a neighboring patterning field relative to a previously written field with an accuracy of about 1 nm. We demonstrate stitching of 1 μm2 fields with ~5 nm accuracy and stitching of larger 10x10 μm2 fields with 10 nm accuracy.[6]

Proceedings Article | 1 October 2013 Paper

Thermal probe nanolithography: in-situ inspection, high-speed, high-resolution, 3D

Felix Holzner, Philip Paul, Michel Despont, Lin Lee Cheong, James Hedrick, Urs Dürig, Armin Knoll

Proc. SPIE. 8886, 29th European Mask and Lithography Conference

KEYWORDS: Lithography, Electron beam lithography, Optical lithography, Polymers, Silicon, Scanning probe lithography, Scanning electron microscopy, Photomasks, Reactive ion etching, Nanolithography

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