Mechanical parameters, especially mechanical stress of membranes used in silicon microphones strongly depend
on the manufacturing process. As a result, deviations during this process can result in sensitivity variations
of the microphone. Therefore, the stress should be well controlled within a certain tensile level. This paper
describes a method to test devices electrically using the MEMS related pull-in phenomenon with respect to the
mechanical compliance of microphone membranes. Using this method, out of specification chips can be detected
at an early stage within the manufacturing process instead of determination at a system functionality test after
packaging. Therefore, the adequacy for the intended use of the pull-in voltage and its dependency on varying
tensile stress due to manufacturing tolerance is evaluated.