Frank Senger
at Fraunhofer-ISIT
SPIE Involvement:
Author
Publications (6)

PROCEEDINGS ARTICLE | March 15, 2016
Proc. SPIE. 9760, MOEMS and Miniaturized Systems XV
KEYWORDS: Microelectromechanical systems, Actuators, Modeling, Mirrors, Scanners, Computing systems, Control systems, 3D modeling, Laser scanners, Finite element methods, Micromirrors, Systems modeling, Piezoelectric drives, Piezoelectric thin film actuators

PROCEEDINGS ARTICLE | February 27, 2015
Proc. SPIE. 9375, MOEMS and Miniaturized Systems XIV
KEYWORDS: Microelectromechanical systems, Mirrors, Modulation, Electrodes, Scanners, High power lasers, Laser applications, Laser scanners, 3D scanning, Semiconducting wafers

PROCEEDINGS ARTICLE | March 7, 2014
Proc. SPIE. 8977, MOEMS and Miniaturized Systems XIII
KEYWORDS: Microelectromechanical systems, Packaging, Mirrors, Oscillators, Modulation, Electrodes, Glasses, High power lasers, Laser based displays, Semiconducting wafers

SPIE Journal Paper | December 2, 2013
JM3 Vol. 13 Issue 01
KEYWORDS: Mirrors, Microelectromechanical systems, Laser scanners, Roads, Sensors, Laser development, Packaging, Wafer bonding, Actuators

PROCEEDINGS ARTICLE | March 13, 2013
Proc. SPIE. 8616, MOEMS and Miniaturized Systems XII
KEYWORDS: Microelectromechanical systems, Packaging, Wafer-level optics, Mirrors, Sensors, Glasses, Silicon, Neodymium, Semiconducting wafers, Wafer bonding

PROCEEDINGS ARTICLE | February 14, 2011
Proc. SPIE. 7930, MOEMS and Miniaturized Systems X
KEYWORDS: Microelectromechanical systems, Packaging, Mirrors, Electrodes, Glasses, Scanners, Silicon, Semiconducting wafers, Wafer bonding

Showing 5 of 6 publications
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