Scaling device dimensions towards atomic scales leads to increased reliability and yield concerns which considerably
affects the work of integrated circuit designers. Furthermore, the complexity of integrated systems increases which leads
to a demand for tool assisted reliability insertion during the design process. Lots of research efforts have focused on softerrors
and system-level approaches. However, only few low-level solutions have been published to enhance lifetime
reliability. Investigations in this field have reached an up to 200 % increased reliability concerning gate oxide breakdown
if so called Twin Gates have been inserted. This contribution comprehensively presents algorithms to implement these
redundant cells automatically during logic synthesis. Besides the placement in the whole design process, approaches are
provided to insert Twin Gates correctly considering timing and area issues.