Dr. Ruedi Wagner
Vice-President Imaging at Leica Geosystems AG
SPIE Involvement:
Conference Program Committee | Author
Publications (11)

SPIE Journal Paper | 1 June 2005
OE Vol. 44 Issue 06
KEYWORDS: Waveguides, Laser ablation, Water, Modulation, Glasses, Laser processing, Laser applications, Optical engineering, Helium neon lasers, Laser cutting

Proceedings Article | 12 April 2005
Proc. SPIE. 5713, Photon Processing in Microelectronics and Photonics IV
KEYWORDS: Laser cutting, Semiconducting wafers, Particles, Semiconductor lasers, Semiconductors, Contamination, Silicon, Gallium arsenide, Abrasives, Pulsed laser operation

Proceedings Article | 15 July 2004
Proc. SPIE. 5339, Photon Processing in Microelectronics and Photonics III
KEYWORDS: Semiconducting wafers, Laser cutting, Silicon, Semiconductor lasers, Laser applications, Semiconductors, Microelectronics, Laser drilling, Water, Micromachining

Proceedings Article | 15 July 2004
Proc. SPIE. 5339, Photon Processing in Microelectronics and Photonics III
KEYWORDS: Ceramics, Laser applications, Laser cutting, Water, Laser processing, Diamond, Pulsed laser operation, Packaging, Fiber lasers, Manufacturing

Proceedings Article | 21 June 2004
Proc. SPIE. 5366, Light-Emitting Diodes: Research, Manufacturing, and Applications VIII
KEYWORDS: Semiconducting wafers, Gallium nitride, Laser cutting, Light emitting diodes, Pulsed laser operation, Nd:YAG lasers, Laser applications, Laser processing, Etching, Semiconductor lasers

Showing 5 of 11 publications
Conference Committee Involvement (1)
Laser Applications in Microelectronic and Optoelectronic Manufacturing X
24 January 2005 | San Jose, California, United States
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