Ms. Fumiko Iwao Profile

Fumiko Iwao

at Tokyo Electron AT Ltd

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Author

Publications (9)

Proceedings Article | 20 March 2015 Paper

Driving DSA into volume manufacturing

Mark Somervell, Takashi Yamauchi, Soichiro Okada, Tadatoshi Tomita, Takanori Nishi, Shinichiro Kawakami, Makoto Muramatsu, Etsuo Iijima, Takeo Nakano, Fumiko Iwao, Seiji Nagahara, Hiroyuki Iwaki, Makiko Dojun, Koichi Yatsuda, Toshikatsu Tobana, Ainhoa Romo Negreira, Doni Parnell, Benjamen Rathsack, Kathleen Nafus, Jean-Luc Peyre, Takahiro Kitano, Vinayak Rastogi

Proceedings Volume 9425, 94250Q (2015) https://doi.org/10.1117/12.2085776

KEYWORDS: Etching, Semiconducting wafers, Optical lithography, Polymethylmethacrylate, Line edge roughness, Manufacturing, Image processing, Ecosystems, Line width roughness, Directed self assembly

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Proceedings Article | 20 March 2012 Paper

High-etching selectivity of spin-on-carbon hard mask process for 22nm node and beyond

Fumiko Iwao, Arisa Hara, Satoru Shimura, Kenichi Oyama, Sakurako Natori, Shohei Yamauchi, Hidetami Yaegashi, Hideharu Kyouda

Proceedings Volume 8325, 832525 (2012) https://doi.org/10.1117/12.916326

KEYWORDS: Etching, Silica, System on a chip, Photoresist processing, Photomasks, Extreme ultraviolet lithography, Scanning electron microscopy, Line edge roughness, Carbon, Particles

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Proceedings Article | 8 April 2011 Paper

Availability of underlayer application to EUV process

Hitoshi Kosugi, Cha-Won Koh, Hai-Sub Na, Hiroshi Marumoto, Chang-Min Park, Kyoungyong Cho, Carlos Fonseca, Cheol-Hong Park, Fumiko Iwao, Hyun-Woo Kim, Hanku Cho

Proceedings Volume 7969, 79692E (2011) https://doi.org/10.1117/12.878730

KEYWORDS: Coating, Semiconducting wafers, Contamination, Extreme ultraviolet, Data modeling, Calibration, Extreme ultraviolet lithography, Scanning electron microscopy, Etching, Thin films

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Proceedings Article | 30 March 2010 Paper

The optimizations of resist shrink process using track-based technology

Ben Rathsack, Michael Carcasi, Masahiro Yamamoto, Yoshihiro Kondo, Satoru Shimura, Atsushi Ookouchi, Takasi Saito, Fumiko Iwao, Tsuyoshi Shibata, Toyohisa Tsuruda

Proceedings Volume 7639, 76390X (2010) https://doi.org/10.1117/12.846497

KEYWORDS: Photoresist processing, Line width roughness, Etching, Semiconducting wafers, Double patterning technology, Diffusion, Image processing, Thin film coatings, Critical dimension metrology, Particles

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Proceedings Article | 11 December 2009 Paper

Implementation of double patterning process toward 22-nm node

Eiichi Nisimura, Sakurako Natori, Shoichi Yamauchi, Arisa Hara, Kazuo Yabe, Satoru Shimura, Kenichi Oyama, Nakajima Shigeru, Fumiko Iwao, Masato Kushibiki, Tetsu Kawasaki, Kazuhide Hasebe, Hidetami Yaegashi, Hiroki Murakami

Proceedings Volume 7520, 75201E (2009) https://doi.org/10.1117/12.839826

KEYWORDS: Double patterning technology, Photoresist processing, Silica, Resolution enhancement technologies, Photoresist materials, Etching, Line width roughness, Lithography, Atomic layer deposition, Optical lithography

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Proceedings Article | 1 April 2009 Paper

Important challenges for line-width-roughness reduction

H. Murakami, Hidetami Yaegashi, M. Kushibiki, T. Kawasaki, K. Hasebe, E. Nishimura, K. Yabe, F. Iwao, S. Shimura, A. Hara

Proceedings Volume 7273, 72732H (2009) https://doi.org/10.1117/12.814126

KEYWORDS: Line width roughness, Etching, Double patterning technology, Silica, Photomasks, Scanners, Lithography, Optical lithography, Chemical vapor deposition, Overlay metrology

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Proceedings Article | 1 April 2009 Paper

Fabrication of 22-nm poly-silicon gate using resist shrink technology

Tetsu Kawasaki, Masato Kushibiki, Fumiko Iwao, Satoru Shimura, Nishimura Eiichi

Proceedings Volume 7273, 72730G (2009) https://doi.org/10.1117/12.814365

KEYWORDS: Photoresist processing, Double patterning technology, Line width roughness, Etching, Optical lithography, Immersion lithography, Photoresist materials, Semiconducting wafers, Lithography, Extreme ultraviolet lithography

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Proceedings Article | 15 April 2008 Paper

Advanced resist process enabling implementation of CD controllability for 32 nm and beyond

Yoshiaki Yamada, Dunn Shannon, Hidetami Yaegashi, Fumiko Iwao, Yoshitsugu Tanaka, Tetsu Kawasaki, Satoru Shimura

Proceedings Volume 6923, 69233C (2008) https://doi.org/10.1117/12.771867

KEYWORDS: Double patterning technology, Photoresist processing, Immersion lithography, Resistance, Extreme ultraviolet, Optical lithography, Thin film deposition, Semiconductors, 193nm lithography, Lithography

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Proceedings Article | 26 March 2008 Paper

Fabrication of 32-nm contact/via hole by photolithographic-friendly method

Michael Carcasi, Kazuhide Hasebe, Steven Scheer, Satoru Shimura, Eiichi Nishimura, Mark Somervell, Masato Kushibiki, Tetsu Kawasaki, Hidetami Yaegashi, Fumiko Iwao

Proceedings Volume 6923, 692333 (2008) https://doi.org/10.1117/12.771907

KEYWORDS: Reactive ion etching, Chemical vapor deposition, Semiconductors, Lithography, Immersion lithography, Etching, 193nm lithography, Photoresist processing, Photoresist materials, Double patterning technology

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Showing 5 of 9 publications

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