The paper overviews some of the most important applications of lasers in the field of microsystems (MEMS). We
present applications from both technology and MEMS testing. Since these applications cover a wide range, the
presentation does not aim to offer a thorough, detailed presentation of each of these, but only to underline some of the
most important directions and features. We present the respective applications, their working principles, their advantages
and their drawbacks. In some cases we present examples of microstructures realized by using laser techniques.
In this paper I present some techniques by which MEMS structures with sub-wavelength resolution can be obtained when using laser lithography. I concentrate on two major techniques: single photon and multi-photon absorption processes.
We present proof-of-principle results regarding the possibility of micro-engraving Potassium Dihydrogen Phosphate (KDP) crystals using laser ablation techniques. The results of the work show that this technique can be used for realizing integrated optics and micro-optics components that are based on such crystals, one of the envisaged directions being that of integrated electro-optical modulators.
Common porous materials, some of which will be considered in the chapters of this book, include concrete, paper, ceramics, clays, porous semiconductors, chromotography materials, and natural materials like coral, bone, sponges, rocks and shells. Porous materials can also be reactive, such as in charcoal gasification, acid rock dissolution, catalyst deactivation and concrete. This study continues the investigations about the properties of, so-called, hollow glass. In this paper is presented a computer simulation approach in which the thermo-mechanical behavior of a 3D microstructure is directly computed. In this paper a computer modeling approach of porous glass is presented. One way to test the accuracy of the reconstructed microstructures is to computed their physical properties and compare to experimental measurement on equivalent systems. In this view, we imagine a new type of porous type of glass designed as buffer layer in multilayered printed boards in ICs. Our glass is a variable material with a variable pore size and surface area. The porosity could be tailored early from the deposition phases that permitting us to keep in a reasonable balance the dielectric constant and thermal conductivity.