Electronic beam lithography (EBL) is commonly used for patterning at the nanoscale by way of a focused electron beam. This process can lead to charge accumulation on the surface of the resist when used in conjunction with non-conductive substrate materials, impacting lithographic quality producing egregious shape placement inaccuracies. Current practice requires the use of a deposited metal or conductive polymer film to facilitate charge dissipation at the surface. Such films are often unstable, incompatible and/or can be difficult to remove after exposure. This paper presents the findings of a study of a novel aqueous based quaternary ammonium compound for use in EBL for charge dissipation on non-conductive substrates. This compound was found to effectively prevent charge accumulations across a broad range of resist materials while remaining highly stable at room temperature and easily removed with deionized water or isopropanol after EBL exposure.
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