Prof. Gregor Feiertag
at Hochschule für Angewandte Wissenschaften München
SPIE Involvement:
Author
Publications (5)

PROCEEDINGS ARTICLE | May 17, 2013
Proc. SPIE. 8763, Smart Sensors, Actuators, and MEMS VI
KEYWORDS: Microelectromechanical systems, Packaging, Sensors, Copper, Ceramics, Aluminum, Adhesives, Sensor technology, Standards development, Temperature metrology

PROCEEDINGS ARTICLE | May 19, 2009
Proc. SPIE. 7362, Smart Sensors, Actuators, and MEMS IV
KEYWORDS: Microelectromechanical systems, MATLAB, Electrodes, Silicon, Resistance, Linear filtering, Capacitance, Acoustics, Tolerancing, Device simulation

PROCEEDINGS ARTICLE | May 19, 2009
Proc. SPIE. 7362, Smart Sensors, Actuators, and MEMS IV
KEYWORDS: Microelectromechanical systems, Packaging, Cell phones, Polymers, Metals, Ceramics, Silicon, Reliability, Acoustics, Semiconducting wafers

PROCEEDINGS ARTICLE | September 1, 1998
Proc. SPIE. 3512, Materials and Device Characterization in Micromachining
KEYWORDS: Gold, Polymethylmethacrylate, Luminescence, X-rays, Electrons, Silicon, Photomasks, Optical alignment, Beryllium, X-ray lithography

PROCEEDINGS ARTICLE | July 7, 1997
Proc. SPIE. 3048, Emerging Lithographic Technologies
KEYWORDS: Microfluidics, Polymethylmethacrylate, Polymers, Metals, Scanners, X-rays, Photomasks, Synchrotron radiation, X-ray lithography, 3D microstructuring

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