Gregor Hemken
at Technische Univ Braunschweig
SPIE Involvement:
Author
Publications (2)

PROCEEDINGS ARTICLE | February 25, 2009
Proc. SPIE. 7202, Laser-based Micro- and Nanopackaging and Assembly III
KEYWORDS: Microelectromechanical systems, Packaging, Thermography, Particles, Printing, Microopto electromechanical systems, Laser cutting, Adhesives, Nanolithography, Industrial chemicals

PROCEEDINGS ARTICLE | February 25, 2009
Proc. SPIE. 7202, Laser-based Micro- and Nanopackaging and Assembly III
KEYWORDS: Consumer electronics, Copper, Coating, Laser processing, Laser development, Laser welding, Semiconductor lasers, Electronic components, Thin film coatings, Pulsed laser operation

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