This paper presents an alternative adhesive bonding system which is able to join very small parts as well as relatively large parts with high accuracy requirements. The main advantages are the possibility to apply small volumes, to preapply the adhesive with a temporarily delayed joining procedure and extremely short set cycles. The center of micro joining develops suitable joining techniques on the basis of non-viscous adhesive systems (hot melts). The process
development focuses on the suitability for automation, process times and the applicability of batch processes. The article
discusses certain hot melt application techniques that are suitable for batch production e. g. the laser-sintering of hot melt
powder, presents an adapted assembly system and shows an example of an automated assembly process for hot melt
coated micro components. Therefore, using hot melts can be a technologically and economically interesting alternative
for the assembly and packaging of MEMS.
In electrical connections with enameled copper wires, isolation material residue can be found in the solder area when the
coating is not stripped. This residue can lead to mechanical and electrical problems. In electronic devices and MEMS,
quality requirements increase with rising thermal requirements for electrical contacts made from enameled copper wire.
Examples for this exist in the area of automotive electronics, consumer electronics and in the field of machine design.
Typical products with electrical connecting which use enameled wires include: micro-phones and speakers (especially
for mobile phones), coil forms, small transformers, relays, clock coils, and so on. Due to increasing thermal and
electrical requirements, the manufacturer of enameled wires continuously develops new isolating materials for the
improvement of isolation classes, thermal resistance, etc. When using current bonding and solder processes, there exist
problems for contacting enameled copper wire with these insulation layers. Therefore the Institute of Joining and
Welding, Department Micro Joining developed a laser based solder process with which enamels copper wires can enable
high quality electrical connections without a preceding stripping process.