Dr. Guido Hennig
Manager Technology Laser at Daetwyler Graphics AG
SPIE Involvement:
Conference Program Committee | Symposium Chair | Conference Chair | Track Chair | Author | Editor
Publications (11)

Proceedings Article | 16 February 2018
Proc. SPIE. 10519, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIII
KEYWORDS: Laser sources, Beam splitters, Modulation, Copper, Beam delivery, Laser engraving, Laser ablation, Printing, Polygon scanners, Pulsed laser operation

Proceedings Article | 12 March 2015
Proc. SPIE. 9351, Laser-based Micro- and Nanoprocessing IX
KEYWORDS: Carbon, Ultrafast phenomena, Metals, Laser engraving, Laser ablation, Printing, Epoxies, Picosecond phenomena, Nonmetals, Pulsed laser operation

Proceedings Article | 13 March 2013
Proc. SPIE. 8607, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVIII
KEYWORDS: Iron, Argon, Crystals, Copper, Gases, Nitrogen, Reflectivity, Oxygen, Aluminum, Single crystal X-ray diffraction

Proceedings Article | 13 March 2013
Proc. SPIE. 8607, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVIII
KEYWORDS: Scanners, Copper, Control systems, Scanning electron microscopy, Laser ablation, Laser scanners, Applied sciences, 3D scanning, Pulsed laser operation, Laser systems engineering

Showing 5 of 11 publications
Conference Committee Involvement (16)
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV
1 February 2020 | San Francisco, California, United States
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV
4 February 2019 | San Francisco, California, United States
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIII
29 January 2018 | San Francisco, California, United States
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXII
30 January 2017 | San Francisco, California, United States
SPIE LASE
28 January 2017 | San Francisco, United States
Showing 5 of 16 published special sections
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