An 810-nm diode laser system was developed to accelerate and improve the healing process in surgical scars. Using
thermal post-conditioning, the laser system provides a localised moderate heating whose maximum temperature is
controlled to prevent tissue damage and stimulate the heat shock proteins (HSP) synthesis. The 810-nm wavelength
allows a deep penetration of the light into the dermis, without damaging the epidermis. The time along which surgical
incision is treated (continuous wave) must therefore be selected carefully with respect to the temperature precision
achieved within the heated volume. A top-hat profile is preferred to a Gaussian profile in order to ensure the skin
surface temperature is homogenised, as is the temperature of the heated volume. The spot shape will depend on the
medical indication. The treatment should be made safe and controlled by means of a safety strip containing an RFID
chip which will transmit the various operating settings to the laser device.
A clinical trial aims at evaluating the 810 nm-diode laser in surgical incisions, with only one laser treatment
immediately after skin closure, of patients with Fitzpatrick skin types I to IV. Surgical incisions were divided into two
fields, with only portions randomly selected receiving laser treatment. At the final scar analysis (12 months) of the pilot
study, the treated portion scored significantly better for both surgeon (P = 0.046) and patients (P = 0.025).
Further studies may be warranted to better understand the cellular mechanisms leading to Laser-Assisted Skin Healing