Dye-Sensitized solar cell (DSSC) is expected to be one of the next-generation photovoltaics because of its environment-friendly and low-cost properties. However, commercialization of DSSC is difficult because of the electrolyte leakage. We propose a new thermal curable base on silicon resin. The resin aimed at sealing of DSSC and gives a promising resolution for sealing of practical DSSC. Furthermore, the optimized resin was fabricated into solar cells, which exhibited best durability by retaining 97% of the initial photoelectric conversion efficiency after 1,000 hours tracking test at 80℃.
Typical Dye-sensitized solar cells (DSSC) are composed of mesoporous TiO<sub>2</sub> nanocrystals electrode on transparent fluorine-doped tin oxide (FTO) substrate, sensitizers on the TiO<sub>2</sub> nanocrystals, platinum (Pt) on the FTO substrate as a counter-electrode, and iodine/iodide electrolytes between the two transparent conducting oxide (TCO) substrate. But two transparent conductive oxide(TCO) substrates are estimated to be about 60[%] of the total cost of the DSSCs. Currently novel TCO-less structures have been investigated in order to reduce the cost. We suggested a TCO-less DSSCs which has titanium layer electrodes. Titanium layer electrodes are formed by electron-beam evaporation method. And we proposed the formation of hole for injecting the electrolyte of DSSC by using lithographic method. The sizes of holes are 4um and the intervals of holes are 2um. Finally, we prepared the 0.45 cm<sup>2</sup> DSSC device and analytical instruments such as electrochemical impedance spectroscopy, scanning electron microscope were used to evaluate the TCO-less DSSCs.