Prof. Hai Ming
at Univ of Science And Technology of China
SPIE Involvement:
Conference Program Committee | Conference Chair | Author | Editor | Student Chapter Advisor
Publications (96)

PROCEEDINGS ARTICLE | January 10, 2018
Proc. SPIE. 10616, 2017 International Conference on Optical Instruments and Technology: Optical Systems and Modern Optoelectronic Instruments
KEYWORDS: Microscopes, Biomedical optics, Imaging systems, Speckle, Scattering, Cameras, Glasses, Photography, Laser speckle contrast imaging, Blood circulation

PROCEEDINGS ARTICLE | September 3, 2015
Proc. SPIE. 9579, Novel Optical Systems Design and Optimization XVIII
KEYWORDS: Light sources, Light emitting diodes, Waveguides, Laser drilling, LCDs, Diffusers, 3D displays, Integral imaging, 3D image processing, Light

PROCEEDINGS ARTICLE | March 11, 2015
Proc. SPIE. 9385, Advances in Display Technologies V
KEYWORDS: Light sources, Imaging systems, Speckle, Cameras, Light scattering, Semiconductor lasers, Speckle pattern, Image quality, Projection systems, Diodes

SPIE Conference Volume | November 24, 2014

PROCEEDINGS ARTICLE | October 24, 2014
Proc. SPIE. 9270, Optoelectronic Devices and Integration V
KEYWORDS: Ultrafast phenomena, Graphene, Mode locking, Quantum cascade lasers, Chemical vapor deposition, Fiber lasers, Raman spectroscopy, Photonics, Optical isolators, Pulsed laser operation

PROCEEDINGS ARTICLE | October 24, 2014
Proc. SPIE. 9270, Optoelectronic Devices and Integration V
KEYWORDS: Microscopes, Optical design, Imaging systems, Photography, Optical tweezers, Objectives, Virtual reality, Imaging arrays, Optical arrays, Integral imaging

Showing 5 of 96 publications
Conference Committee Involvement (16)
Holography, Diffractive Optics, and Applications VIII
11 October 2018 | Beijing, China
Optoelectronic Devices and Integration VII
11 October 2018 | Beijing, China
Optoelectronic Devices and Integration VI
12 October 2016 | Beijing, China
Holography, Diffractive Optics, and Applications VII
12 October 2016 | Beijing, China
Optoelectronic Devices and Integration V
9 October 2014 | Beijing, China
Showing 5 of 16 published special sections
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