Hailan Song
at Beijing Univ of Posts and Telecommunications
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 3 December 2009 Paper
Proc. SPIE. 7631, Optoelectronic Materials and Devices IV
KEYWORDS: Wafer bonding, Semiconducting wafers, Silicon, Interfaces, Annealing, Scanning electron microscopy, Wafer-level optics, Surface finishing, Diffusion, Telecommunications

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