A road map has been proposed for the design methodology of a RF MEMS switch. The design methodology for RF
MEMS is often an interactive process which involves continuous adjustments for the specifications, structure and the
fabrication steps. This helps in defining and obtaining the required RF microwave specifications. A novel RF MEMS D
shape capacitive shunt switch is proposed. The switch structure is fabricated on a high resistive silicon substrate. This
structure consists of coplanar waveguide transmission line, a D shape lower electrode with thin dielectric layer on top
and suspended membrane bridge. The lower electrode of the switch is fabricated in D shape using high viscosity and
high conductive adhesives. The switch RF path is fabricated on top of silicon dioxide using a thick coplanar waveguide
transmission line. The thick transmission line metal connects to the lower electrode and the dielectric material to form
the through path of a shunt switch. The suspended metal membrane spans the two coplanar ground lines. With no applied
actuation voltage the residual tensile stress keeps the membrane suspended above the RF path. By applying an
electrostatic field between membrane and the lower electrode an attractive force causes the floating membrane to pull
down and make contact with the lower electrode and dielectric surface to form a low impedance RF path to ground.
Main area to which the development aims is lowering the actuation voltage to levels compatible with mainstream IC
technologies, while maintaining the RF performance. Proposed switch has shown satisfactory performance between 0-40
GHz frequency range. Paper will present simulation and theoretical results. Experimental results of conductive epoxy
fabrication are also presented. This switch could have an important application in the telecommunication network like
switching networks.
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