Heather A. Florence
Senior Application Engineer at SAES
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 23 December 2003 Paper
Proceedings Volume 5343, (2003) https://doi.org/10.1117/12.525099
KEYWORDS: Semiconducting wafers, Microelectromechanical systems, Silicon, Wafer bonding, Packaging, Glasses, Particles, Industrial chemicals, Carbon monoxide, Silicon films

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