Mr. Hengyi Jin
Research Associate, PhD Student at Swinburne Univ of Technology
SPIE Involvement:
Author
Publications (7)

PROCEEDINGS ARTICLE | April 2, 2004
Proc. SPIE. 5276, Device and Process Technologies for MEMS, Microelectronics, and Photonics III
KEYWORDS: Fabrication, Microfluidics, Polymers, Copper, Nickel, Interfaces, Manufacturing, Laser ablation, Excimer lasers, Liquids

PROCEEDINGS ARTICLE | November 14, 2002
Proc. SPIE. 4935, Smart Structures, Devices, and Systems
KEYWORDS: Actuators, Etching, Polymers, Copper, Nickel, Laser processing, Microactuators, Excimer lasers, Micromachining, Temperature metrology

PROCEEDINGS ARTICLE | November 13, 2002
Proc. SPIE. 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems
KEYWORDS: Thin films, Copper, Laser processing, Laser ablation, Photoresist materials, Signal processing, Excimer lasers, Micromachining, Acoustic emission, Acoustics

PROCEEDINGS ARTICLE | November 21, 2001
Proc. SPIE. 4592, Device and Process Technologies for MEMS and Microelectronics II
KEYWORDS: Confocal microscopy, Optical lithography, Polymers, Copper, Nickel, Laser ablation, Laser scanners, Excimer lasers, Plating, Electroplating

PROCEEDINGS ARTICLE | November 21, 2001
Proc. SPIE. 4592, Device and Process Technologies for MEMS and Microelectronics II
KEYWORDS: Confocal microscopy, Optical lithography, Etching, Polymers, Copper, Nickel, Silicon, Laser ablation, Photoresist materials, Excimer lasers

PROCEEDINGS ARTICLE | November 21, 2001
Proc. SPIE. 4592, Device and Process Technologies for MEMS and Microelectronics II
KEYWORDS: Thin films, Optical lithography, Polymers, Metals, Laser ablation, Excimer lasers, Micromachining, Laser damage threshold, Pulsed laser operation, Shape memory alloys

Showing 5 of 7 publications
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