A coherence scanning tomographic imaging system with an innovative signal correction method is presented for a critical dimension (CD) measurement of thin film transistor liquid crystal display patterns having multiple focus positions within a single field of view. To facilitate the analyzing of coherence signals, a simulation model based on fast Fourier transform method is proposed, and its simulated result is compared with the coherence signals from the actual experiments. The comparison shows that the majority of frequency characteristics from simulation modeling results are matched with the experimental results. However, in many edge regions, discrepancies in frequency characteristics between the two results are observed. For the interpretation of signals, those are different from the simulation modelling, in that the intensity of its pixels has been corrected by an innovatively proposed connected neighborhoods window method with multiple window sizes. By using this combination of tomographic imaging and edge correction methods, the repeatability of the CD measurement of multiple focus position samples is significantly enhanced compared to the results with a plain two-dimensional optics. The proposed method is also compared with the autofocus methods including gradient magnitude method and frequency domain method and other tomographic imaging methods, including the phase shift method and the Hilbert transform method to show the advantages in the processing time.
We report a system for performing critical-dimension (CD) measurements of glass panels that uses a substepping system to generate a sequence of lower-resolution images and a fast, edge-directed image reconstruction algorithm to combine these images into a higher-resolution image. A large working distance and large aperture of microscope objective is required in glass panel manufacturing, to measure very small distances at high-level repeatability in a short time, which in turn allows only low magnification objectives. Low-resolution images are obtained when the camera of the CD measurement system is moved at step intervals smaller than the normal pixel size of the camera sensor. We propose a fast, edge-directed image registration (IR) algorithm to find the subpixel accuracy information for full-size images to be registered. The number of processed pixels is only about 5% to 10% of the number of pixels in the image, and the algorithm runs noniteratively. Thus, the subpixel IR algorithm is faster than other methods. In addition, a weighting calculation method for fast and robust edge-directed image interpolation algorithm is proposed to form a high-resolution image. Our experimental results prove that the proposed method offers faster processing time than the standard process and acceptable repeatability of CD measurements.
Fringe projection with phase shifting technology has been widely used for micro solder bump inspection. Spherical
solder bump is referred to as specular-dominant, mirror-like, metallic reflection. Specifically, the saturated area is placed
on the top of the bump surface, it makes the height profile distort and could not interpret reliable height data. In this
paper, we propose a new three-dimensional measurement system with circular motion that can easily evaluate
relationship between projection angle and reflectance of the bump, tackling these issues. The proposed system without
any additional polarizer and cameras, makes saturated pixels far away from the center of the solder surface so that most
saturated pixels are placed on the out of the measuring target area by increasing projection angle. The accurate height
profile and high repeatability are obtained as reliable measurement results with the optimal projection angle, and it shows
high potential for practical micro bump inspection in field.
We report experimental studies on laser scribing of thin film solar cells using various types of short pulsed lasers
(nanosecond, picosecond, and femtosecond temporal pulse widths), aiming to determine the optimum laser parameters
for the scribing of multilayer structures of amorphous silicon (a-Si) and copper indium diselenide (CIS) based solar cells.
Detailed laser scribing parameters such as repetition rate of the laser pulses, scanning speed of the sample and laser
beam, individual pulse energy, laser wavelength, and direction of laser illumination (either from film side or from
substrate side) are examined. Characteristics of each scribing conditions are evaluated in terms of morphology by atomic
force microscopy (AFM) and scanning electron microscopy (SEM), chemical species analysis by Energy Dispersive X-ray
Spectroscopy (EDS), and electrical conductance of interconnects by conductive AFM (c-AFM) and contact
resistance measurement to determine the optimal laser scribing conditions. Further issues on defects in the films such as
re-deposited debris, elevated molten rim and delamination, thermal damage to surrounding and/or underlying layers and
inter-diffusion of materials at the interface are discussed on the basis of thermal/mass diffusion, thermal stress, and
ablation-induced plasma formation, in order to demonstrate an efficient laser scribing of P1/P2/P3 of thin film solar
cells.
Thickness of thin film measurement is a important information for the TFT-LCD and semiconductor process, ranging
from spectro-photometry to interferometry. In particular many efforts have been devoted for development of
measurement system to obtain thickness and surface profile. In this paper, we propose a new method by using wavelet
transform to retrieve the phase information, and we demonstrate, with both theoretical and experimental data, that this
method provides a reliable technique for retrieving phase in the wavelength scanning interferomety. Also we show that
the proposed method can reconstruct the non linear phase better than other methods such as the conventional fourier
transform and direct spectral phase calculation method. In the experimental data, we verify that the error of measurement
using proposed method is less than those other methods. The patterned thin film is measured with the proposed method
to obtain the thickness profile and surface profile simultaneously, demonstrating higher accuracy and performance.
As the product size become smaller, much smaller sized parts are increasingly required in many products fabrication such as cameras, camcorders, and electric appliances, etc. Small or micro gears whose sizes are about few hundred micrometers to few millimeters have been greatly required for the above products, as they become most efficient parts for power transmission. The small of micro gears are prone to geometrical and functioning inaccuracy during the micro fabrication processes, and thus the measurement system has been desired for the geometry and performance checking of gears. In this paper, a precision inspection system is developed for the gear checking, consisting of the optical vision microscope, vision image processing modules with subpixel accuracy, and the profile inspection software using the virtual master jigs/gears mathematically generated. For accurate analysis of the gear geometry from the captured gear image through the optical vision system, a highly accurate vision image processing algorithm has been implemented, where two dimensional subpixelling technique is developed having about one tenth subpixel accuracy. A mathematically generated mater gears/jigs are implemented: several core parameters of the gear profile are calculated from the comparison between the virtual master and the measured gears. Virtual precision ball jigs are simulated between gear teeth profile, and thus the runout parameter can be successfully evaluated from the virtual jig movement on the gear teeth image. The eccentricity parameters can also be calculated from the sinusoidal fitting of the virtual ball movement. The development precision inspection system for small or micro gears has been applied to practical gears of various range, and the essential gear parameters are successfully measured with sub micrometer accuracy.
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