Dr. Hong Xiao
Technologist at KT
SPIE Involvement:
Author | Instructor
Area of Expertise:
Semiconductor manufacturing process technologies , Electron beam defect inspection , Electron beam defect review , Applications of SEM in IC chip manufacturing , IC chip manufacturing technology trends
Profile Summary

Dr. Hong Xiao is a technologist of EBEAM department of KLA-Tencor Corp., with expertise of applications of electron beam defect inspection and scanning electron microscope defect review in IC chip manufacturing processes. Previously; he is technical marketing specialist at Hermes-Microvision, Inc. and technical manager of Hermes Epitek Corp. He was also a consultant of semiconductor process technology, senior process engineer in Motorola Semiconductor Production Sector, and an associate professor of Austin Community College in Semiconductor Manufacturing Technology program. After receiving the Ph.D. in physics from the University of Texas at Austin, Dr. Xiao worked at Applied Materials as senior technical instructor, with expertise in dielectric thin film deposition, semiconductor process integration and plasma physics. Dr. Xiao authored and coauthored over 30 journal and conference papers. He has more than 20 patents in US and other countries. He is the author of textbooks, “Introduction to Semiconductor Manufacturing Technology” the second edition published by SPIE Press in Dec. 2012 and “3D IC Devices, Technologies, and Manufacturing” published by SPIE Press in 2016. He is a member of SPIE since 2005 and lifetime member of Chinese American Semiconductor Professional Association.
Publications (16)


PROCEEDINGS ARTICLE | April 18, 2013
Proc. SPIE. 8681, Metrology, Inspection, and Process Control for Microlithography XXVII
KEYWORDS: Metals, Copper, Tungsten, Inspection, Scanning electron microscopy, Transmission electron microscopy, Monte Carlo methods, Semiconducting wafers, Chemical mechanical planarization, Virtual colonoscopy


PROCEEDINGS ARTICLE | April 28, 2011
Proc. SPIE. 7971, Metrology, Inspection, and Process Control for Microlithography XXV
KEYWORDS: Etching, Inspection, Electron microscopes, Scanning electron microscopy, Data acquisition, Field effect transistors, Critical dimension metrology, Semiconducting wafers, Defect inspection

PROCEEDINGS ARTICLE | April 7, 2011
Proc. SPIE. 7969, Extreme Ultraviolet (EUV) Lithography II
KEYWORDS: Lithography, Defect detection, Opacity, Particles, Manufacturing, Inspection, Electronic components, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography

PROCEEDINGS ARTICLE | September 25, 2010
Proc. SPIE. 7823, Photomask Technology 2010
KEYWORDS: Defect detection, Opacity, Inspection, Scanning electron microscopy, Optical inspection, Bridges, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Defect inspection

Showing 5 of 16 publications
Course Instructor
SC1009: Electron Beam Inspection - Principles and Applications in IC and Mask Manufacturing
This course explains basic principles and applications of electron beam inspection (EBI). The primary goals of the course are to describe the basic of scanning electron microscope (SEM) imaging, defect behavior in the SEM image, case studies of EBI applications in semiconductor process development, and capability studies of EBI applications on EUV and NIL masks. Basics principles of design for inspection (DFI) and some case studies of EBI test circuit design are also covered.
SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Back to Top