Dr. Hong Xiao is a technologist of EBEAM department of KLA-Tencor Corp., with expertise of applications of electron beam defect inspection and scanning electron microscope defect review in IC chip manufacturing processes. Previously; he is technical marketing specialist at Hermes-Microvision, Inc. and technical manager of Hermes Epitek Corp. He was also a consultant of semiconductor process technology, senior process engineer in Motorola Semiconductor Production Sector, and an associate professor of Austin Community College in Semiconductor Manufacturing Technology program. After receiving the Ph.D. in physics from the University of Texas at Austin, Dr. Xiao worked at Applied Materials as senior technical instructor, with expertise in dielectric thin film deposition, semiconductor process integration and plasma physics. Dr. Xiao authored and coauthored over 30 journal and conference papers. He has more than 20 patents in US and other countries. He is the author of textbooks, “Introduction to Semiconductor Manufacturing Technology” the second edition published by SPIE Press in Dec. 2012 and “3D IC Devices, Technologies, and Manufacturing” published by SPIE Press in 2016. He is a member of SPIE since 2005 and lifetime member of Chinese American Semiconductor Professional Association.
High-throughput critical dimensions uniformity (CDU) measurement of two-dimensional (2D) structures using scanning electron microscope (SEM) systems
Demonstration of defect free EUV mask for 22nm NAND flash contact layer using electron beam inspection system
Study of devices leakage of 45nm node with different SRAM layouts using an advanced e-beam inspection systems