Dr. Hong Xiao
Technologist at KLA Corp
SPIE Involvement:
Author | Instructor
Area of Expertise:
Semiconductor manufacturing process technologies , Electron beam defect inspection , Electron beam defect review , Applications of SEM in IC chip manufacturing , IC chip manufacturing technology trends
Profile Summary

Dr. Hong Xiao is a technologist of EBEAM department of KLA-Tencor Corp., with expertise of applications of electron beam defect inspection and scanning electron microscope defect review in IC chip manufacturing processes. Previously; he is technical marketing specialist at Hermes-Microvision, Inc. and technical manager of Hermes Epitek Corp. He was also a consultant of semiconductor process technology, senior process engineer in Motorola Semiconductor Production Sector, and an associate professor of Austin Community College in Semiconductor Manufacturing Technology program. After receiving the Ph.D. in physics from the University of Texas at Austin, Dr. Xiao worked at Applied Materials as senior technical instructor, with expertise in dielectric thin film deposition, semiconductor process integration and plasma physics. Dr. Xiao authored and coauthored over 30 journal and conference papers. He has more than 20 patents in US and other countries. He is the author of textbooks, “Introduction to Semiconductor Manufacturing Technology” the second edition published by SPIE Press in Dec. 2012 and “3D IC Devices, Technologies, and Manufacturing” published by SPIE Press in 2016. He is a member of SPIE since 2005 and lifetime member of Chinese American Semiconductor Professional Association.
Publications (16)

SPIE Press Book | 29 April 2016
KEYWORDS: Photomasks, Etching, Silicon, Oxides, Semiconducting wafers, Metals, Dielectrics, Tin, Manufacturing

Proceedings Article | 18 April 2013 Paper
Proc. SPIE. 8681, Metrology, Inspection, and Process Control for Microlithography XXVII
KEYWORDS: Metals, Copper, Tungsten, Inspection, Scanning electron microscopy, Transmission electron microscopy, Monte Carlo methods, Semiconducting wafers, Chemical mechanical planarization, Virtual colonoscopy

SPIE Press Book | 19 November 2012
KEYWORDS: Semiconducting wafers, Etching, Silicon, Oxides, Metals, Dielectrics, Ions, Plasma, Copper, Photoresist materials

Proceedings Article | 28 April 2011 Paper
Proc. SPIE. 7971, Metrology, Inspection, and Process Control for Microlithography XXV
KEYWORDS: Etching, Inspection, Electron microscopes, Scanning electron microscopy, Data acquisition, Field effect transistors, Critical dimension metrology, Semiconducting wafers, Defect inspection

Proceedings Article | 7 April 2011 Paper
Proc. SPIE. 7969, Extreme Ultraviolet (EUV) Lithography II
KEYWORDS: Lithography, Defect detection, Opacity, Particles, Manufacturing, Inspection, Electronic components, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography

Showing 5 of 16 publications
Course Instructor
SC1009: Electron Beam Inspection - Principles and Applications in IC and Mask Manufacturing
This course explains basic principles and applications of electron beam inspection (EBI). The primary goals of the course are to describe the basic of scanning electron microscope (SEM) imaging, defect behavior in the SEM image, case studies of EBI applications in semiconductor process development, and capability studies of EBI applications on EUV and NIL masks. Basics principles of design for inspection (DFI) and some case studies of EBI test circuit design are also covered.
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