Dr. Hongtao Han
at Shenzhen O-Film Technologies Co Ltd
SPIE Involvement:
Conference Program Committee | Author
Publications (5)

Proceedings Article | 3 December 2009
Proc. SPIE. 7631, Optoelectronic Materials and Devices IV
KEYWORDS: Packaging, Wafer-level optics, Cell phones, Cameras, Glasses, Image sensors, Integrated optics, Semiconducting wafers, Optics manufacturing, Wafer bonding

Proceedings Article | 30 April 1999
Proc. SPIE. 3631, Optoelectronic Integrated Circuits and Packaging III
KEYWORDS: Packaging, Wafer-level optics, Optical components, Sensors, Silicon, Optical alignment, Vertical cavity surface emitting lasers, Semiconducting wafers, Active optics, Optics manufacturing

Proceedings Article | 30 April 1999
Proc. SPIE. 3631, Optoelectronic Integrated Circuits and Packaging III
KEYWORDS: Optical fibers, Diffractive optical elements, Fiber optics, Etching, Silicon, Micro optics, Integrated optics, Optical alignment, Optics manufacturing, Optical arrays

Proceedings Article | 20 September 1996
Proc. SPIE. 2893, Fiber Optic Components and Optical Communication
KEYWORDS: Optical fibers, Switches, Etching, Crystals, Silicon, Optoelectronics, Optical alignment, Optical switching, Optical arrays, Anisotropic etching

Proceedings Article | 29 March 1996
Proc. SPIE. 2691, Optoelectronic Packaging
KEYWORDS: Fiber to the x, Etching, Silicon, Manufacturing, Optical alignment, Reactive ion etching, Photomicroscopy, Semiconducting wafers, Tolerancing, Optoelectronic packaging

Conference Committee Involvement (1)
Photonics Packaging and Integration II
26 January 2000 | San Jose, CA, United States
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