Dr. Hoonchul Ryoo Profile

Dr. Hoonchul Ryoo

at Samsung Mobile Display Co Ltd

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Proceedings Article | 14 February 2008 Paper

Temporal and spectral analysis of laser induced plasma in the ablation process of flexible printed circuit board

Seok Kim, Hoon Ryoo, Jae Hahn

Proceedings Volume 6879, 68791N (2008) https://doi.org/10.1117/12.762025

KEYWORDS: Plasma, Copper, Laser ablation, Laser induced breakdown spectroscopy, Plasma generation, Laser processing, Pulsed laser operation, Polymers, Signal to noise ratio, Flex printed circuits

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Flexible printed circuit board (FPCB), consisting of copper sheets laminated onto non conductive film substrates with multiple structures, are core elements in electronics with their flexibility and capability of high density 3 dimensional wiring characteristics. In laser applied FPCB processing, a better understanding of the ablation mechanism leads to precision control of the depth processing especially by monitoring of the material transition layer. For this purpose, here we investigate the temporal and spectral behavior of the plasma plum generated on the single sided structure of FPCB using the technique of laser induced breakdown spectroscopy (LIBS). Using KrF excimer laser, the characteristic spectral emission lines of C₂ swan band at the wavelength of 516.5 nm and neutral copper at the wavelength range from 510 nm to 522 nm are acquired under ambient pressure in the ablation process of polyimide film and copper coated layer respectively. From a time delay from 50 ns to 4.05 μs from the beginning of the laser pulse, the temporal profiles of the spectral intensity are obtained in steps of 200 ns, which have a tendency of exponential decrease on both C₂ and neutral copper. In particular, we concentrate our attention on the temporal intensity behavior of the Bremsstrahlung continuum emission that decides the proper set of detection time window, by which the monitoring sensitivity of LIBS is determined. Finally, using the information of the temporal analysis for each molecular, atomic, and continuum emission, the transition layer between polyimide and copper film is distinguished by their characteristic peak information.

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