Ultrashort laser pulses offer enormous potential for precise micro structuring, especially of transparent materials [1-2]. When focusing ultrashort laser pulses into the material, the intensity in the focus volume is sufficient to induce non-linear absorption processes, which lead to structural changes in the material volume [3]. In the following study, the localized structural changes were arranged in order to produce cut surfaces for the extraction of 2.5D bodies with potential applications for example in the production of micro implants. The investigations were carried out in polylactide, a bioresorbable polymer. For this purpose, a femtosecond laser source was used which emits pulses of 200 fs pulse length at a wavelength of 1030 nm. Microscope objectives with focal lengths in the range of 12.5 mm down to 2 mm were used, which resulted in focal radius of 1.2 μm in minimum and hence extremely high intensities of about 1015W/cm2 to excite nonlinear absorption effects. Process-influencing parameters such as pulse energy, pulse distance and frequency were varied to investigate their effect on the quality of the cut-out bodies. The feasibility of the technology could be demonstrated on the basis of simple bodies.
We have designed and fabricated 2D GMR spin valve sensors on the basis of IrMn/CoFe/Cu/CoFe/NiFe nanolayers in monolithic integration for high sensitivity applications. For a maximum signal-to-noise ratio, we realize a focused double full bridge layout featuring an antiparallel exchange bias pinning for neighbouring meanders and an orthogonal pinning for different bridges. This precise alignment is achieved with microscopic precision by laser heating and subsequent in-field cooling.
Striving for maximum signal sensitivity and minimum hysteresis, we study in detail the impact of single meander geometry on the total magnetic structure and electronic transport properties. The investigated geometrical parameters include stripe width, stripe length, cross bar material and total meander length. In addition, the influence of the relative alignment between reference magnetization (pinned layer) and shape anisotropy (free layer) is studied. The experimentally obtained data are moreover compared to the predictions of tailored micromagnetic simulations.
Using a set of optimum parameters, we demonstrate that our sensor may readily be employed to measure small magnetic fields, such as the ambient (geomagnetic) field, in terms of a 2D vector with high spatial (~200 μm) and temporal (~1 ms) resolution.
Since the discovery of selective laser sintering/melting, numerous modifications have been made to upgrade or customize this technology for industrial purposes. Laser micro sintering (LMS) is one of those modifications: Powders with particles in the range of a few micrometers are used to obtain products with highly resolved structures. Pulses of a q-switched laser had been considered necessary in order to generate sinter layers from the micrometer scaled metal powders. LMS has been applied with powders from metals as well as from ceramic and cermet feedstock’s to generate micro parts. Recent technological progress and the application of high brilliant continuous laser radiation have now allowed an efficient laser sintering/melting of micrometer scaled metal powders. Thereby it is remarkable that thin sinter layers are generated using high continuous laser power. The principles of the process, the state of the art in LMS concerning its advantages and limitations and furthermore the latest results of the recent development of this technology will be presented. Laser Micro Sintering / Laser Micro Melting (LMM) offer a vision for a new dimension of additive fabrication of miniature and precise parts also with application potential in all engineering fields.
We report on a fast machining process for cutting silicon wafers using laser radiation without melting or ablating and
without additional pretreatment.
For the laser induced cutting of silicon materials a defocused Gaussian laser beam has been guided over the wafer
surface. In the course of this, the laser radiation caused a thermal induced area of tension without affecting the material
in any other way. With the beginning of the tension cracking process in the laser induced area of tension emerged a
crack, which could be guided by the laser radiation along any direction over the wafer surface. The achieved cutting
speed was greater than 1 m/s. We present results for different material modifications and wafer thicknesses. The
qualitative assessment is based on SEM images of the cutting edges.
With this method it is possible to cut mono- and polycrystalline silicon wafers in a very fast and clean way, without
having any waste products. Because the generated cracking edge is also very planar and has only a small roughness, with
laser induced tension cracking high quality processing results are easily accessible.
We report on selective realignment of the magnetization direction of the exchange biased ferromagnetic layer in two
different spintronic layer stacks using laser radiation. The exchange bias effect occurs in an
antiferromagnetic/ferromagnetic bilayer system when cooled in an external magnetic field below the Néel temperature
and results in a shift of the ferromagnetic hysteresis loop with increased coercivity. The effect is utilized to pin the
magnetization direction of the reference ferromagnetic layer in spin valve systems. We investigated the realignment of
the pinned magnetization direction in a spin valve system with in plane exchange bias and in a Co/Pt multilayer with
perpendicular exchange bias. The layer stacks were heated above the Néel temperature in a defined lateral area by using
rapidly deflected laser radiation. Two different laser assisted annealing techniques were investigated applying either
continuous or pulsed laser radiation. During laser annealing, the sample was subjected to an external magnetic field in
order to selectively realign the magnetization direction of the pinned ferromagnetic layer. Magnetic structuring was
performed by heating narrow single tracks as well as irradiating single pulses. By using a magneto optical sensor in
combination with a polarization microscope, the magnetic structures have been visualized. After laser annealing of
larger-scaled areas, the exchange bias field strength and the coercive field strength were analyzed using a magneto
optical Kerr effect set up (MOKE). The impact of the processing parameters laser peak intensity, laser pulse duration,
scan speed (continuous wave) and magnetic field strength on the resulting reversed exchange bias field was evaluated.
The paper presents results obtained in a comparative study of laser irradiation of tungsten powder surfaces using a continuous wave fiber laser and a high repetition rate femtosecond laser. Depending on the energy input per unit length different melt structures have been produced. In general, if the same average laser power level was applied the structures show the same appearance independent from the laser source. But there was both a little higher degree of initial fusing and cross-linking along the processed path when the powder surface was irradiated with ultrashort pulses. Further, with increasing laser intensity a change in structure formation as well as a broadening of the laser processed path has been occurred, although the energy input per unit length remains constant. However, accumulation of slab-like structures, which was previously observed in high-intense ultrashort pulse laser irradiation, has been become more pronounced in cw laser irradiation above a certain number of consecutive scans. Moreover, characteristic effects, such as formation of ripples and nanomelt structures appearing in ultrashort pulse laser processing have been not detected in cw laser irradiation.
Since a few years, high brilliance laser sources find their way into laser material processing. Laser micro processing by
applying high brilliance laser radiation up to 3 kW of continuous wave laser power in combination with ultrafast beam
deflection systems has been successfully demonstrated in 2008 for the first time. In the fields of laser welding, high brilliant laser radiation was mainly used for micro welding, but up to now the macro range is still insufficiently investigated. Hence, this study reports on detailed investigations of high speed laser welding of different steel grades, performed with a high power single mode fiber laser source. The laser beam was deflected relative to the sample by using both a fast galvanometer scanner system with f-theta focusing objective and a linear axis in combination with a welding optic, respectively. In the study, the mainly process influencing parameters such as laser power, welding speed, thickness of the metal sheets, angle of incidence and laser beam spot size were varied in a wide range. The weld seam quality was evaluated by structural analyses, static tensile tests and EDX measurements. Finally, the laser welding process has been optimized for different weld seam geometries, for example bead-on-plate welds and butt welds.
In laser ablation cutting, irradiation of high-intense laser beams causes ejection of molten and evaporated material out of the cutting zone as a result of high pressure gradients, induced by expanding plasma plumes. This paper investigates highspeed laser ablation cutting of industrial grade metal sheets using high-brilliant continuous wave fiber lasers with output powers up to 5 kW. The laser beam was deflected with scan speeds up to 2700 m/min utilizing both a fast galvanometer scan system and a polygon scan system. By sharp laser beam focusing using different objectives with focal lengths ranging between 160 mm and 500 mm, small laser spot diameters between 16.5 μm and 60 μm were obtained, respectively. As a result high peak intensities between 3*108 W/cm² and 2.5*109 W/cm² were irradiated on the sample surface, and cutting kerfs with a maximum depth of 1.4 mm have been produced.
In this study the impact of the processing parameters laser power, laser spot diameter, cutting speed, and number of scans on both the achievable cutting depth and the cutting edge quality was investigated. The ablation depths, the heights of the cutting burr, as well as the removed material volumes were evaluated by means of optical microscope images and cross section photographs. Finally highspeed laser ablation cutting was studied using an intensified ultra highspeed camera in order to get useful insights into the cutting process.
In this paper processing of transparent materials by laser radiation from various sources with short (nanoseconds) and
ultrashort (femtoseconds) pulse lengths at different wavelengths is discussed. The investigations were carried out with a
short pulse Nd:YVO4 laser (1064 nm, 532 nm) and a high repetition rate femtosecond fiber laser (1030 nm). In our experiments
the laser beam was guided across the probe either through the motion of a coordinate table or through a laser
scanner with an f-theta-objective.
In our study we investigated in detail the influence of important process parameters like wavelength, pulse width, and
irradiation regime upon micro defect generation inside bulk glass (BK glass, fused silica) and polymers (polymethylmethacrylate,
polycarbonate, cyclo-olefin-copolymers). By applying an irradiation regime with optimal process parameters
these locally confined material defects can be aligned as to yield cut surfaces for the excision of 3d parts that consist of
transparent material with bulk properties. Especially for the production of irregularly shaped 3d parts a CAD-CAM software
tool was developed that automatically converts geometry data into a processing program.
Laser microsintering of tungsten powder is investigated as a function of laser output power, pulse interval and vacuum
level. The intensities are calculated for the evaporation thresholds of tungsten powder particles of various sizes. In
addition, the powder layer generation and the resulting layer thicknesses are calculated. The powder abrasion occurring
during the process was taken into consideration. Polished sections and REM images were prepared in order to analyse
the experimental outcomes. The dependence of sinter density on the parameters is discussed.
Previously, in high repetition rate femto second laser processing novel laser matter interacting effects were reported,
such as heat accumulation and particle shielding. In this study, high repetition rate laser processing was investigated to
discuss and understand the impact of laser repetition rate and accompanied accumulative laser material interacting
effects. Therefore, a high repetition rate femto second fibre laser setup joint together with galvo scanner technology was
applied in laser micro machining of metals (copper, stainless steel, aluminium). High repetition rate laser processing of
aluminium and stainless steel lead to considerably lowered ablation thresholds accompanied with higher ablation rates.
Laser ablation behaviour of copper was almost independent of the repetition rate with neither considerable lower ablation
thresholds nor higher ablation rates. For explanation, heat accumulation caused by higher repetition rates were assumed
as mainly ablation behaviour influencing effect, but thermal material properties have to be considered.
Furthermore laser machining examples demonstrate the possibilities and limits of high repetition rate laser processing in
3d micro structuring. Thus, by using innovative scanning systems and machining strategies very short processing times
were achieved, which lead to high machining throughputs and attract interest of the innovative laser technology in Rapid
Micro Tooling. For discussion, high repetition rate processing results are evaluated by means of comparative machining
examples obtained with 1 kHz femto second laser system.
Many materials have already been investigated for laser micro sintering. Nearly all technical metals can be processed
with this rapid prototyping technology. A new field of investigation is the sintering of ceramics.
For industrial and also for medical, especially dental, application silicon dioxide is a multiply applicable material. One of
its interesting features is that the properties of the resulting material can be varied between ceramic on the one and
vitreous on the other side, depending on the extent of crystalline or amorphous character of the nano-scale structure. A
special problem with laser micro sintering of ceramics is the poor absorption of Nd:YAG laser radiation by most of the
materials. Besides that, laser micro sintering of ceramics, in contrary to the process with metals, is not merely a series of
aggregational transitions.
A solution for the micro part generation of SiO2 is reported. Typical laser sintering results from this material are
presented. Material specific behaviors during laser micro sintering are discussed.
In this paper we are going to present FEM calculations applied for laser bending of silicon microstructures and compare them with our experimental results. According to the mechanisms in plastic deformation of metals with laser radiation we performed calculations to find out, if there are similar mechanisms in forming of silicon. To model the laser heating up mechanism we have to take into account several physical effects like heat radiation or reflection of silicon for the used laser radiation. To transform the laser bending process into a FE model the boundary conditions include compromises and simplifications of the geometry and the energy input. In our calculations we modelled the laser beam as a moving heat source in order to get information about the temperature distribution, the temperature gradient and the heat flow in dependence on the position on the sample and the time. The calculated essentially higher temperatures at the edges of the structure compared to the middle of the structure, exceeding the melting point there, are in very good agreement to the melting areas observed at the edges in the experi-ments. After a number of consecutive scans we reach a balanced temperature field moving with the laser beam across the surface. The calculations revealed that there is a steep temperature gradient in the depth of the structure indicating a similar temperature gradient mechanism observed in forming of metals with laser radiation. Additionally we carried out temperature field calculations to determine the influence of the process parameters like the laser power, the velocity of the heat source, the material thickness or the position of laser treatment on the temperature field generated in the material. The results of the calculations are in very good agreement with our experiments. Next time stress field calculations are intended. At the moment there are not enough data on the plastic behaviour of silicon available to the authors in order to get reliable results.
Microparts with a structural resolution of <30μm and aspect ratios of >12 have been generated by selective laser sintering. The technique includes sintering under conditions of vacuum or reduced shield gas pressures. In a novel set-up the material is processed by a Q-switched 1064nm Nd-YAG laser after a special raking procedure. The procedure allows the work pieces to be generated from powders of high melting metals like tungsten as well as lower melting metals like aluminium and copper. Contingent on the parameters, the generated bodies are either firmly attached to the substrate or can be dissevered by a non-destructive method.
A novel device suited for the generation of sintered microparts of metal and ceramics, for reaction sintering and for CVD has been developed and successfully tested. With the production of a functional component it has evidenced professional performance. The set-up is vacuum tight; unstable substances can be processed under various shield gases and pressures; it is equipped with a device suited to rake thin layers of fine powders as well as slurries. Sub micrometer powder can be processed in steps of 1 μm thick sintered layers. In combination with a proprietary sintering regime, micro parts with a structural resolution of <30μm, and aspect ratios of >10 have been achieved.
We are going to present a new technology for laser machining of silicon developed at the Laser Institute of Mittweida by a suggestion and in cooperation with the Technical University of Chemnitz, Department of Electrical Engineering and Information Technology. It allows the laser induced bending of microstructural silicon elements prepared by anisotropic wet etching. Bending of the element toward the incident laser beam occurs as a result of the laser induced thermal stresses in the material. We investigated the influence of various process parameters on the bending angle. There is only a small range of laser power to generate bendings in silicon. We will show a variety of examples including multiple and also continuous bendings. There are several essential advantages compared to conventional bending technologies: Laser bending is a contactless process without using additional tools or external forces. Because of the local laser treatment the heat flux to neighbouring material can be minimized so that the technology is suitable for machining of already finished microsystems. This new technology opens up a new field of applications in microsystem technologies. It is possible to generate a clip-chip-mechanism to clip a chip in a holder. Other examples are the exact positioning of optical mirrors or other components, the production of electrostatic drives and sliding chips for micro optical benches.
We are going to present a new technology for laser bending of silicon microstructures based upon a suggestion of and carried out in cooperation with Prof. Dr. J. Frühauf from the Technical University Chemnitz (see acknowledgement).
We investigated the influence of various laser process parameters on the bending angle and its reproducibility. Bending of the silicon element as a result of the laser induced thermal stresses in the material occurs toward the incident laser beam. The bending angle depends on a lot of laser process and material parameters. In particular we found that the irra-diation regime is well suited to control the bending angle. First substantial FEM based calculations of laser induced temperature fields using a moving laser heat source show the temperature field propagation in the material and reveal some regions of complicated overheating. As a result of our experiments we show a variety of examples including mul-tiple and also continuous bendings.
There are several essential advantages compared to conventional bending technologies with this new method: Laser bending is contactless without using additional tools or external forces. Because of the local laser treatment the heat flux to the neighbouring material is minimized. The laser beam can be applied through windows of glass that means to al-most hermetically sealed micro devices. So laser technology is suitable for machining of already finished microsystems.
It opens up a wide field of applications in micro system technologies: clip-chip-mechanism or sliding chips for micro optical benches, the adjustment of optical mirrors or other components or the ability of continuous bending for electro-static drives and so on.
Presently, there is a growing demand from the industry for microprocessing of materials. For applications in microsystems technology and biotechnology it is particularly necessary to produce structures with dimensions down to the micrometer scale. This refers especially to materials that can not or not in a sufficiently quality be processed by conventional methods of silicon technologies.
In order to fulfil the industrial demands we have investigated the structuring of anodic bondable PYREX glass and of polymers by means of laser microprocessing using the excimer laser mask projection technique (193 nm wavelength, 10 ns pulse duration, 8 mJ pulse energy, 500 Hz repetition rate). In our paper we will show the dependence of the obtained quality especially the roughness of the generated surfaces on the processing parameters. The possibilities of our technology including the creation of holes, channels and three dimensional microstructures will be presented too. Single structures e.g. bridges and grooves are attainable with widths of 10 micrometers and below. Some of the drilled holes (diameter about 50 µm) have been successfully filled inside with aluminium by a laser assisted CVD process.
We are presenting a very successful new method of a laser welding technology developed in the Laser Institute of Mittel-sachsen. It allows us to join parts of alumina without any changes of their properties base don an additive free procedure. Furthermore it enables us to carry out the procedure without furnaces and in natural atmosphere within only a few minutes. In order to avoid thermally included stresses two laser beams are used. We will describe this procedure of laser welding of ceramics including the manner of preheating: their limits and advantages. The thermal influence on the welding bath and the grain structure will be discussed. High pure laser welded Al2O3-ceramic parts of various shapes will be presented. This new method of laser welding of ceramics opens up a wide field of new application. Almost now a lot of branches of industry have already shown their interest in this promising technique. Most applications are expected with sensor elements generally, and in the protection of electronic elements against high temperatures, abrasion and/or chemical attacks.
Presently, there is a going demand from the industry for microprocessing of materials. In particular, for application in the field of microsystem technology it is necessary to produce structures with dimensions down to the micrometer scale in various materials. We have been investigating the structuring of silicon, anodic bondable PYREX glass, Al2O3-ceramic and PMMA by means of laser microprocessing using an excimer laser and TEA CO2 laser. Both the mask projection technique and the focusing technique have been employed. We will show the dependence of the ablation thresholds and the ablation rates on the laser parameters and on the physical properties of the materials, i.e. absorption coefficient, melting point and thermal conductivity. During and after the laser processing of different glasses we observed the formation of cracks in the laser irradiated region and partly in the glass wafer surrounding the drilled holes. Those crack formations should be due to the developed of thermally induced mechanical stress in the glass.
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