Hoyeon Kim
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (5)

PROCEEDINGS ARTICLE | March 24, 2017
Proc. SPIE. 10143, Extreme Ultraviolet (EUV) Lithography VIII
KEYWORDS: Reticles, Logic, Scanners, Manufacturing, Pellicles, Transmittance, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Chemical elements

PROCEEDINGS ARTICLE | April 20, 2011
Proc. SPIE. 7971, Metrology, Inspection, and Process Control for Microlithography XXV
KEYWORDS: Metrology, Data modeling, Image processing, Denoising, Inspection, Scanning electron microscopy, Photoresist materials, Line width roughness, Critical dimension metrology, Semiconducting wafers

PROCEEDINGS ARTICLE | September 23, 2009
Proc. SPIE. 7488, Photomask Technology 2009
KEYWORDS: Lithography, Monochromatic aberrations, Aberration correction, Metrology, Scanners, Solids, Projection systems, Optical alignment, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | May 19, 2008
Proc. SPIE. 7028, Photomask and Next-Generation Lithography Mask Technology XV
KEYWORDS: Lithography, Etching, Manufacturing, Photomasks, Line width roughness, Beam shaping, Critical dimension metrology, Line edge roughness, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | March 20, 2008
Proc. SPIE. 6921, Emerging Lithographic Technologies XII
KEYWORDS: Lithography, Electron beam lithography, Etching, Manufacturing, Photomasks, Line width roughness, Critical dimension metrology, Line edge roughness, Semiconducting wafers, Overlay metrology

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