Huan Ting Tseng
at United Microelectronics Corp
SPIE Involvement:
Author
Publications (3)

Proceedings Article | 6 April 2007
Proc. SPIE. 6519, Advances in Resist Materials and Processing Technology XXIV
KEYWORDS: Line width roughness, Etching, Photoresist processing, Optical proximity correction, Image processing, Semiconducting wafers, Immersion lithography, Lithography, Line edge roughness, Scanning electron microscopy

Proceedings Article | 14 March 2006
Proc. SPIE. 6156, Design and Process Integration for Microelectronic Manufacturing IV
KEYWORDS: Process modeling, Finite element methods, Semiconducting wafers, Data modeling, Photomasks, Lithography, Manufacturing, Calibration, Photoresist processing, Inspection

Proceedings Article | 10 May 2005
Proc. SPIE. 5752, Metrology, Inspection, and Process Control for Microlithography XIX
KEYWORDS: Overlay metrology, Chemical mechanical planarization, Metrology, Semiconducting wafers, Tungsten, Optical alignment, Manufacturing, Metals, Image processing, Optical design

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