Dr. Hubert Teyssedre Profile

Dr. Hubert Teyssedre

at Cea;Grenoble

SPIE Involvement:

Author

Publications (8)

Proceedings Article | 16 August 2019 Presentation

Sub 10nm patterning using DNA origami (Conference Presentation)

Raluca Tiron, Marie Marmiesse, Guillaume Thomas, Hubert Teyssedre, Xavier Baillin

Proceedings Volume 10958, 1095810 (2019) https://doi.org/10.1117/12.2515811

KEYWORDS: Optical lithography, Photomasks, Silica, Silicon, Nanolithography, Lithography, HF etching, Etching, Plasma, New and emerging technologies

Read Abstract +

Proceedings Article | 26 March 2019 Paper

Evaluation of adhesion layers performances for soft UV nanoimprint lithography

F. Delachat, H. Teyssedre, L. Pain, X. Chevalier, Célia Nicolet, Christophe Navarro

Proceedings Volume 10958, 1095816 (2019) https://doi.org/10.1117/12.2515607

KEYWORDS: Semiconducting wafers, Nanoimprint lithography, Adhesives, Ultraviolet radiation, Silicon, Thin films, Etching, Coating

Read Abstract +

Proceedings Article | 19 September 2018 Paper

Application of rules-based corrections for wafer scale nanoimprint processes and evaluation of predictive models

H. Teyssedre, P. Quemere, J. Chartoire, F. Delachat, F. Boudaa, L. Perraud, M. May

Proceedings Volume 10775, 107750A (2018) https://doi.org/10.1117/12.2326106

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Nanoimprint lithography, Calibration, Manufacturing, Silicon, Lithography, Coating, Data modeling, Scanning electron microscopy

Read Abstract +

Proceedings Article | 20 March 2018 Presentation + Paper

Dependencies of bias tables to pattern density, critical dimension, global coordinates and pattern orientation for nanoimprint master manufacturing for the 200 mm wafer scale SmartNIL process

P. Quemere, J. Chartoire, F. Delachat, F. Boudaa, L. Perraud, M. May, H. Teyssedre

Proceedings Volume 10588, 1058807 (2018) https://doi.org/10.1117/12.2299326

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Nanoimprint lithography, Manufacturing, Metrology, Photoresist processing, Silicon, Data modeling, Coating, Scanning electron microscopy

Read Abstract +

Proceedings Article | 13 March 2018 Paper

Evaluation of anti-sticking layers performances for 200mm wafer scale Smart NILTM process through surface and defectivity characterizations

F. Delachat, J.-C. Phillipe, V. Larrey, F. Fournel, S. Bos, H. Teyssèdre , Xavier Chevalier, Célia Nicolet, Christophe Navarro, Ian Cayrefourcq

Proceedings Volume 10586, 1058615 (2018) https://doi.org/10.1117/12.2298407

KEYWORDS: Semiconducting wafers, Nanoimprint lithography, Silicon, Manufacturing, Scanning electron microscopy, Inspection, Particles, Etching, Photomasks, Ultraviolet radiation

Read Abstract +

Proceedings Article | 10 April 2017 Presentation + Paper

Nanoimprint, DSA, and multi-beam lithography: patterning technologies with new integration challenges

S. Landis, H. Teyssedre, G. Claveau, I. Servin, F. Delachat, M. L. Pourteau, A. Gharbi, P. Pimenta Barros, R. Tiron, L. Nouri, N. Possemé, M. May, P. Brianceau, S. Barnola, Y. Blancquaert, J. Pradelles, P. Essomba, A. Bernadac, B. Dal'zotto, S. Bos, M. Argoud, G. Chamiot-Maitral, A. Sarrazin, C. Tallaron, C. Lapeyre, L. Pain

Proceedings Volume 10149, 101490K (2017) https://doi.org/10.1117/12.2259966

KEYWORDS: Directed self assembly, Lithography, Line width roughness, Nanoimprint lithography, Semiconducting wafers, Etching, Electron beam lithography, System on a chip, Critical dimension metrology, Photoresist processing

Read Abstract +

Proceedings Article | 21 March 2017 Paper

Rules-based correction strategies setup on sub-micrometer line and space patterns for 200mm wafer scale SmartNIL process within an integration process flow

H. Teyssedre, S. Landis, P. Brianceau, M. Mayr, C. Thanner, M. Laure, W. Zorbach, M. Eibelhuber, L. Pain, M. Chouiki, M. Wimplinger

Proceedings Volume 10144, 101440V (2017) https://doi.org/10.1117/12.2260002

KEYWORDS: Semiconducting wafers, Nanoimprint lithography, Manufacturing, Critical dimension metrology, Lithography, High volume manufacturing, Calibration, Standards development, Etching, Silicon, Metrology, Scanning electron microscopy

Read Abstract +

Proceedings Article | 20 October 2016 Paper

Critical dimension uniformity characterization of nanoimprinted trenches for high volume manufacturing qualification

H. Teyssedre, S. Landis, C. Thanner, V. Schauer, M. Laure, W. Zorbach, L. Pain, S. Bos, M. Eibelhuber, M. Wimplinger

Proceedings Volume 10032, 100320M (2016) https://doi.org/10.1117/12.2250194

KEYWORDS: High volume manufacturing, Nanoimprint lithography, Semiconducting wafers, Critical dimension metrology, Silicon, Ultraviolet radiation, Polymers, Manufacturing, Metrology, Scanning electron microscopy

Read Abstract +

Showing 5 of 8 publications

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years