Dr. Hugo Cramer
Systems Engineer YieldStar CD metrology at ASML Netherlands BV
SPIE Involvement:
Conference Program Committee | Author | Instructor
Publications (18)

Proceedings Article | 13 March 2018
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Metrology, Logic, Control systems, Optical metrology, Measurement devices, Logic devices, Overlay metrology, Front end of line

Proceedings Article | 13 June 2017
Proc. SPIE. 10449, Fifth International Conference on Optical and Photonics Engineering
KEYWORDS: Semiconductors, Lithography, Metrology, Manufacturing, Scatterometry, Process control, Semiconductor manufacturing, Critical dimension metrology, Semiconducting wafers, Overlay metrology

Proceedings Article | 28 March 2017
Proc. SPIE. 10145, Metrology, Inspection, and Process Control for Microlithography XXXI
KEYWORDS: Reticles, Metrology, Logic, Etching, Scanners, Manufacturing, Process control, Critical dimension metrology, Semiconducting wafers, Wafer testing

Proceedings Article | 24 March 2016
Proc. SPIE. 9778, Metrology, Inspection, and Process Control for Microlithography XXX
KEYWORDS: Reticles, Metrology, Optical lithography, Etching, Scanners, Control systems, Scatterometry, Process control, Critical dimension metrology, Semiconducting wafers

Proceedings Article | 24 March 2016
Proc. SPIE. 9778, Metrology, Inspection, and Process Control for Microlithography XXX
KEYWORDS: Lithography, Diffraction, Metrology, Opacity, Image processing, Scanners, Control systems, Scatterometry, Optical metrology, Signal processing, Process control, Critical dimension metrology, Semiconducting wafers, Overlay metrology

Showing 5 of 18 publications
Conference Committee Involvement (4)
Metrology, Inspection, and Process Control for Microlithography XXXIV
24 February 2020 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXIII
25 February 2019 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXII
26 February 2018 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXI
27 February 2017 | San Jose, California, United States
Course Instructor
SC1100: Scatterometry in Profile, Overlay and Focus Process Control
Scatterometry is an optical method to measure profile characteristics of repetitive features printed on a wafer. These profile characteristics are related to process control parameters for monitoring and control applications. This course explains the basic principles of scatterometry, including HW, measurements methodologies and algorithms. Multiple examples of scatterometry application for process monitoring and control in R&D and high volume semiconductor manufacturing are discussed. A primary goal of the course is to reveal the capabilities and limitations of scatterometry and the consequences for the application space.This course explains the basic principles of scatterometry and its application for process monitoring and control in high volume semiconductor manufacturing. A primary goal of the course is to reveal the capabilities and limitations of scatterometry and the consequences for the application space.
SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Advertisement
Advertisement
Back to Top