Mr. Huixiong Dai
DMTS at Applied Materials Inc
SPIE Involvement:
Author
Publications (28)

PROCEEDINGS ARTICLE | October 16, 2017
Proc. SPIE. 10450, International Conference on Extreme Ultraviolet Lithography 2017
KEYWORDS: Amorphous silicon, Optical lithography, Etching, Silicon, Chemical vapor deposition, Photoresist materials, Silicon films, Extreme ultraviolet, Physical vapor deposition, Head-mounted displays

PROCEEDINGS ARTICLE | April 2, 2014
Proc. SPIE. 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII
KEYWORDS: Signal to noise ratio, Lithography, Metrology, Polarization, Inspection, Wafer inspection, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Semiconducting wafers

PROCEEDINGS ARTICLE | March 27, 2014
Proc. SPIE. 9051, Advances in Patterning Materials and Processes XXXI
KEYWORDS: Lithography, Optical lithography, Etching, Silicon, Manufacturing, Reflectivity, Photoresist materials, Double patterning technology, Semiconducting wafers, System on a chip

PROCEEDINGS ARTICLE | April 12, 2013
Proc. SPIE. 8683, Optical Microlithography XXVI
KEYWORDS: Optical lithography, Etching, Metals, Scanners, Copper, Double patterning technology, Optical alignment, Neodymium, Chemical mechanical planarization, Back end of line

PROCEEDINGS ARTICLE | April 1, 2013
Proc. SPIE. 8679, Extreme Ultraviolet (EUV) Lithography IV
KEYWORDS: Semiconductors, Lithography, Calibration, Metals, Ultraviolet radiation, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, High volume manufacturing, Semiconducting wafers

PROCEEDINGS ARTICLE | April 1, 2013
Proc. SPIE. 8679, Extreme Ultraviolet (EUV) Lithography IV
KEYWORDS: Reticles, Optical lithography, Etching, Manufacturing, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Critical dimension metrology, Semiconducting wafers, Overlay metrology

Showing 5 of 28 publications
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