Dr. Hyung Rae Lee
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (7)

PROCEEDINGS ARTICLE | March 27, 2014
Proc. SPIE. 9051, Advances in Patterning Materials and Processes XXXI
KEYWORDS: Lithography, Etching, Polymers, Nitrogen, Scanning electron microscopy, Photoresist materials, Polymerization, Particle swarm optimization, Photoresist processing, Photoresist developing

PROCEEDINGS ARTICLE | April 1, 2009
Proc. SPIE. 7273, Advances in Resist Materials and Processing Technology XXVI
KEYWORDS: Lithography, Etching, Reflectivity, Process control, Photomasks, Optical proximity correction, Critical dimension metrology, Line edge roughness, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | March 16, 2009
Proc. SPIE. 7274, Optical Microlithography XXII
KEYWORDS: Lithography, Diffraction, Reticles, Optical lithography, Polarization, Fourier transforms, Critical dimension metrology, Line edge roughness, Semiconducting wafers, Fiber optic illuminators

PROCEEDINGS ARTICLE | April 1, 2008
Proc. SPIE. 6924, Optical Microlithography XXI
KEYWORDS: Oxides, Lithography, Etching, Silicon, Reflectivity, Control systems, Photomasks, Critical dimension metrology, Semiconducting wafers, Chemical mechanical planarization

PROCEEDINGS ARTICLE | May 4, 2005
Proc. SPIE. 5753, Advances in Resist Technology and Processing XXII
KEYWORDS: Lithography, Optical lithography, Etching, Dry etching, Silicon, Chemistry, Photomasks, Line width roughness, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | May 14, 2004
Proc. SPIE. 5376, Advances in Resist Technology and Processing XXI
KEYWORDS: Lithography, Scanners, Diffusion, Scatterometry, Photomasks, Critical dimension metrology, Line edge roughness, Photoresist processing, Semiconducting wafers, Temperature metrology

Showing 5 of 7 publications
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