Emerging memory technologies such as Resistive Memory (RRAM) have gained a lot of attention to meet the requirements of a potential analog computing element, due to its non-volatile characteristics, scalability and energy efficiency. An RRAM device typically consists of a resistive switching layer (e.g. HfO2) sandwiched between two metal electrodes. Since oxygen vacancies are critical to the functioning of the device, it is desirable to achieve residue free etching using oxygen-less plasmas, and preferably minimize exposure to ambient environment. In this work, we discuss the RRAM patterning challenges and their impact on the device characteristics including the switching/forming voltage.