Dr. Igor Turovets
Scientist at Nova Measuring Instruments Ltd
SPIE Involvement:
Author | Instructor
Publications (18)

Proceedings Article | 25 June 2019
Proc. SPIE. 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII
KEYWORDS: Lithography, Metrology, Optical lithography, Inspection, Capacitance, Process control, Machine learning

Proceedings Article | 26 March 2019
Proc. SPIE. 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII
KEYWORDS: Oxides, Diffractive optical elements, Etching, Resistance, Scatterometry, Capacitance, Process control, Machine learning, Critical dimension metrology, Semiconducting wafers

Proceedings Article | 26 March 2019
Proc. SPIE. 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII
KEYWORDS: Metrology, Data modeling, Chemical species, Atomic force microscopy, Scatterometry, Machine learning, Deposition processes, Semiconducting wafers, Scatter measurement, Zirconium dioxide

Proceedings Article | 2 August 2018
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Metrology, Etching, Atomic force microscopy, Transmission electron microscopy, Signal processing, Photomasks, Extreme ultraviolet, Semiconducting wafers

Proceedings Article | 24 March 2016
Proc. SPIE. 9778, Metrology, Inspection, and Process Control for Microlithography XXX
KEYWORDS: Lithography, Metrology, Optical lithography, Diffractive optical elements, Etching, Scatterometry, Process control, Critical dimension metrology, Semiconducting wafers, Scatter measurement

Proceedings Article | 23 March 2016
Proc. SPIE. 9782, Advanced Etch Technology for Nanopatterning V
KEYWORDS: Metrology, Optical lithography, Etching, Copper, Scatterometry, Optical metrology, Process control, Semiconducting wafers, Optics manufacturing, Chemical mechanical planarization

Showing 5 of 18 publications
Course Instructor
SC1100: Scatterometry in Profile, Overlay and Focus Process Control
Scatterometry is an optical method to measure profile characteristics of repetitive features printed on a wafer. These profile characteristics are related to process control parameters for monitoring and control applications. This course explains the basic principles of scatterometry, including HW, measurements methodologies and algorithms. Multiple examples of scatterometry application for process monitoring and control in R&D and high volume semiconductor manufacturing are discussed. A primary goal of the course is to reveal the capabilities and limitations of scatterometry and the consequences for the application space.This course explains the basic principles of scatterometry and its application for process monitoring and control in high volume semiconductor manufacturing. A primary goal of the course is to reveal the capabilities and limitations of scatterometry and the consequences for the application space.
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