Dr. Indira Kaepplinger Profile

Dr. Indira Kaepplinger

at CiSMT

SPIE Involvement:

Author

Publications (5)

Proceedings Article | 9 March 2022 Presentation

UVC LEDs: increase in optical performance through an optimized potting material

Indira Kaepplinger, Toni Schildhauer, Dennis Mitrenga, Guido Leibeling, Martin Schädel, Thomas Ortlepp

Proceedings Volume PC12022, PC120220E (2022) https://doi.org/10.1117/12.2609826

KEYWORDS: Light emitting diodes, Refractive index, Reflection, Optical testing, Metrology, Mercury, Medical devices, Lamps

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Proceedings Article | 5 March 2021 Presentation

Factors influencing the emission characteristics of UV LED chips: The modular system for module optimization

Indira Kaepplinger, Dennis Mitrenga, Guido Leibeling, Frank Gindele, Yoshio Kikuchi, Olaf Brodersen, Thomas Ortlepp

Proceedings Volume 11706, 117060J (2021) https://doi.org/10.1117/12.2575072

KEYWORDS: Ultraviolet light emitting diodes, Ultraviolet radiation, Light emitting diodes, Thermography, UV optics, Optical components, Deep ultraviolet, Water, Medical diagnostics, Medical devices

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Proceedings Article | 28 February 2020 Presentation + Paper

Chip level fiber coupling

Ch. Möller, H.-G. Ortlepp, I. Käpplinger, K. Neckermann, T. Ortlepp

Proceedings Volume 11286, 1128614 (2020) https://doi.org/10.1117/12.2543020

KEYWORDS: Sensors, Fiber couplers, Optical fibers, Silicon, Photodiodes, Fiber Bragg gratings, Semiconducting wafers, Fiber optics sensors, Superconductors, Single photon detectors

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Proceedings Article | 1 March 2019 Paper

An innovative Si package for high-performance UV LEDs

Indira Kaepplinger, Robert Taeschner, Dennis Mitrenga, Dominik Karolewski, Long Li, Christian Meier, Martin Schaedel, Thomas Ortlepp

Proceedings Volume 10940, 109400A (2019) https://doi.org/10.1117/12.2509395

KEYWORDS: Light emitting diodes, Silicon, Semiconducting wafers, Reflectors, Fresnel lenses, Aluminum, Diodes, Ultraviolet light emitting diodes, Resistance, Quartz

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Proceedings Article | 15 February 2018 Paper

Thermocompression bonding for high-power-UV LEDs

Indira Kaepplinger, Dominik Karolewski, Geert Brockmann, Thomas Ortlepp, Olaf Brodersen, Andreas Thies, Jens Rass, Sven Einfeldt, Neysha Lobo-Ploch, Christoph Stoelmacker, Frank Schnieder

Proceedings Volume 10554, 105541B (2018) https://doi.org/10.1117/12.2287720

KEYWORDS: Light emitting diodes, Ultraviolet radiation, Copper, Metals

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