KEYWORDS: Finite element methods, 3D applications, Microelectronics, Device simulation, Telecommunications, Electronic components, Medium wave, Acoustics, Signal processing, Computer simulations
The rapid growth of the telecommunication and microelectronic industry has been pushing the performance limit
of the passive and active electronic components and devices alike. Thereby, improved performance of the devices
has become a necessity for operating frequencies moving into the MW region. Examples are Surface Acoustic
Wave (SAW) and Bulk AcousticWave (BAW) Devices which are miniaturized microelectronic devices with a wide
range of applications in signal processing, forming and sensing. Computation of electroacoustic field distribution
in these structures needs to be accurate, efficient and rigorous. However, the amount of data required for preand
post-processing is immensely large, and the processing and handling of data are extremely time consuming.
In this paper we propose a conceptually novel method for significantly reducing the computational time and
thus enhancing efficiency by pre-calculating relevant data, storing, and subsequently retrieving them whenever
they are required for device analysis and simulation. We propose a method for symbolically and conveniently
calculating two- or three dimensional integrals over the surface of an arbitrary triangle or within the volume of
an arbitrary tetrahedral. The results we have obtained are universal in that their application is not limited to
microacoustic devices.
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