Mr. Jérôme Reche Profile

Jérôme Reche

at CEA-LETI

SPIE Involvement:

Author

Area of Expertise:

Metrology , Microelectronic , Data treatment , Microscopy , X-Ray , Data fusion

Profile Summary

A PhD Student in metrology for microelectronics with 3 years of experience in lithography process and one year in software development, who also holds a keen interest on information technology. I believe that the future of metrology resides on data treatment and especially data fusion.

Publications (4)

Proceedings Article | 26 March 2019

Application of PSD for the extraction of programmed line roughness from SAXS

Jérôme Reche, Maxime Besacier, Patrice Gergaud, Yoann Blancquaert

Proc. SPIE. 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII

KEYWORDS: Diffraction, Metrology, Fourier transforms, Scanning electron microscopy, Line width roughness, Critical dimension metrology, Line edge roughness

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Proceedings Article | 19 September 2018

Manufacturing of roughness standard samples based on ACF/PSD model programming

Jérôme Reche, Maxime Besacier, Patrice Gergaud, Yoann Blancquaert

Proc. SPIE. 10775, 34th European Mask and Lithography Conference

KEYWORDS: Lithography, Metrology, Manufacturing, Computer programming, Scanning electron microscopy, Line width roughness, Critical dimension metrology, Line edge roughness, Statistical modeling, Edge roughness

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SPIE Journal Paper | 31 July 2018

Programmed line width roughness metrology by multitechniques approach

Jérôme Reche, Maxime Besacier, Patrice Gergaud, Yoann Blancquaert, Guillaume Freychet, Thibault Labbaye

JM3 Vol. 17 Issue 04

KEYWORDS: Metrology, Line width roughness, Critical dimension metrology, Sensors, X-rays, Scanning electron microscopy, Reflectivity, Scattering, Reliability, Manufacturing

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Proceedings Article | 13 March 2018

Programmed LWR metrology by multi-techniques approach

Jérôme Reche, Maxime Besacier, Patrice Gergaud, Yoann Blancquaert, Guillaume Freychet, Thibault Labbaye

Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII

KEYWORDS: Metrology, X-rays, Manufacturing, Reliability, Reflectivity, Scanning electron microscopy, Microelectronics, Line width roughness, Critical dimension metrology

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