Jack M. Kleinfeld
President & Consulting Engineer at Kleinfeld Technical Services Inc
SPIE Involvement:
Conference Program Committee | Author | Instructor
Publications (4)

Proceedings Article | 18 May 2012
Proc. SPIE. 8354, Thermosense: Thermal Infrared Applications XXXIV
KEYWORDS: Infrared cameras, Thermography, Infrared imaging, Nose, Buildings, Bridges, Convection, Infrared signatures, Heat flux, Temperature metrology

Proceedings Article | 28 March 2005
Proc. SPIE. 5782, Thermosense XXVII
KEYWORDS: Infrared detectors, Thermography, Infrared imaging, Water, Solids, Thermal effects, Finite element methods, Infrared signatures, Thermal modeling, Temperature metrology

Proceedings Article | 19 March 1999
Proc. SPIE. 3700, Thermosense XXI
KEYWORDS: Thermography, Glasses, Particles, Complex systems, Structural analysis, Finite element methods, Convection, Chemical elements, Body temperature, Thermal modeling

Proceedings Article | 19 March 1999
Proc. SPIE. 3700, Thermosense XXI
KEYWORDS: Infrared imaging, Lithium, Cameras, Polymers, Scanners, Coating, Process control, Process engineering, Temperature metrology, Liquids

Conference Committee Involvement (5)
Thermosense XXIX
10 April 2007 | Orlando, Florida, United States
Thermosense XXVIII
17 April 2006 | Orlando (Kissimmee), Florida, United States
Thermosense XXVII
29 March 2005 | Orlando, Florida, United States
Thermosense XXVI
13 April 2004 | Orlando, Florida, United States
Thermosense XXV
22 April 2003 | Orlando, Florida, United States
Course Instructor
SC543: FEA for Heat Transfer Analysis in Thermography and Hardware Design
The course will present the use of finite element analysis (FEA) to perform heat transfer analysis. FEA is a numerical solution method with wide applicability. It allows solutions to problems that are difficult or impossible to solve explicitly. It is readily performed using commercially available software. Stress will be placed on the use of heat transfer analysis to improve the effectiveness, efficiency, and application of infrared thermography. Application to product troubleshooting, improvement, design and testing will also be illustrated. This will not be a software training course.
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