As Integrated Circuit (IC) manufacturing moves towards smaller design rules and shorter product life cycles, the automatic application of Scanning Electron Microscopy (SEM) becomes more critical in advanced wafer fabrication processes. In most of the advanced IC manufacturers, automatic SEM defect review has been integrated into the IC fabrication process flow. Hence, a review methodology that can provide faster, accurate and reliable information on the yield limiting defects in an automated way, will definitely reduce the time to root cause analysis and thus improve yield and fab productivity. This paper provides a study of how the fab productivity was improved through the implementation of 45°-tilt Automatic Defect Re-detection (ADR) using the in-line defect review Applied Materials SEMVision. In addition to automatic review benefits, using the 45°-tilt capability also provides extra information necessary for root-cause analysis and yield improvement.