Jae-Hyun Kang
Senior Engineer at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (23)

PROCEEDINGS ARTICLE | March 18, 2015
Proc. SPIE. 9427, Design-Process-Technology Co-optimization for Manufacturability IX
KEYWORDS: Lithography, Phase modulation, Visualization, Manufacturing, Design for manufacturing, Image classification, Yield improvement, Process modeling, Land mines, Library classification systems

PROCEEDINGS ARTICLE | March 29, 2013
Proc. SPIE. 8684, Design for Manufacturability through Design-Process Integration VII
KEYWORDS: Lithography, Electronics, Visualization, Metals, Manufacturing, Bridges, Design for manufacturing, Double patterning technology, Resolution enhancement technologies, Design for manufacturability

PROCEEDINGS ARTICLE | March 15, 2012
Proc. SPIE. 8327, Design for Manufacturability through Design-Process Integration VI
KEYWORDS: Photovoltaics, Metals, Image processing, 3D modeling, Scanning electron microscopy, Design for manufacturing, Optical proximity correction, Semiconducting wafers, Process modeling, Chemical mechanical planarization

PROCEEDINGS ARTICLE | March 15, 2012
Proc. SPIE. 8327, Design for Manufacturability through Design-Process Integration VI
KEYWORDS: Polishing, Logic, Metals, Silicon, Manufacturing, Design for manufacturing, Optical proximity correction, Failure analysis, Yield improvement, Back end of line

PROCEEDINGS ARTICLE | March 15, 2012
Proc. SPIE. 8327, Design for Manufacturability through Design-Process Integration VI
KEYWORDS: Lithography, Optical lithography, Silicon, Manufacturing, Data processing, Semiconducting wafers, Tolerancing, Failure analysis, Chemical mechanical planarization, Design for manufacturability

PROCEEDINGS ARTICLE | April 4, 2011
Proc. SPIE. 7974, Design for Manufacturability through Design-Process Integration V
KEYWORDS: Semiconductors, Lithography, Data modeling, Visualization, Pattern recognition, Manufacturing, Design for manufacturing, Computer aided design, Semiconducting wafers, Device simulation

Showing 5 of 23 publications
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