The multi-configurative microscopic system for inspecting the wire-bonding of reed frame is designed. Object rays is nearly collimated by a objective lens group which is a common lens group of x2 and x6 imaging lens systems and is splitted by two beam-splitters composed of a penta-prism and a refracting prism. And object rays started from the central region and the boundary region(reed frame region) on semiconductor chip(that is, the object) are imaged at the two different imaging planes by x2 and x6 imaging lens groups, respectively. The x6 imaging lens system with a constant object distance and a constant magnification is well designed by general imaging optics system design method. However, since the depth of wire structure on the reed frame has about ±3 mm, in order to observe by a constant magnification and at a fixed imaging plane without the dependency on the variation of objective distance generated by the depth of wire structure on the reed frame, the imaging lens system is composed of two separated groups, which should be moved along nonlinear locus like mechanically compensated zoom lenses. The nonlinear equations for zoom locus are derived by using the Gaussian bracket. Refraction powers and positions of each groups are numerically determined by solving the equations, and initial design data for each groups is obtained by using Seidel third order aberration theory. The optimization technique is finally utilized to obtain this multi-configurative microscopic system.