Jae-Woo Lee
at Dongjin Semichem Co Ltd
SPIE Involvement:
Author
Publications (11)

PROCEEDINGS ARTICLE | March 27, 2014
Proc. SPIE. 9051, Advances in Patterning Materials and Processes XXXI
KEYWORDS: Lithography, Etching, Polymers, Nitrogen, Scanning electron microscopy, Photoresist materials, Polymerization, Particle swarm optimization, Photoresist processing, Photoresist developing

PROCEEDINGS ARTICLE | March 23, 2010
Proc. SPIE. 7636, Extreme Ultraviolet (EUV) Lithography
KEYWORDS: Optical lithography, Deep ultraviolet, Polymers, Diffusion, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Line edge roughness, Semiconducting wafers, Chemically amplified resists

PROCEEDINGS ARTICLE | April 1, 2009
Proc. SPIE. 7273, Advances in Resist Materials and Processing Technology XXVI
KEYWORDS: Lithography, Polymers, Glasses, X-rays, Reflectivity, Extreme ultraviolet, Line width roughness, Chemical analysis, Extreme ultraviolet lithography, Molecular interactions

PROCEEDINGS ARTICLE | April 3, 2007
Proc. SPIE. 6519, Advances in Resist Materials and Processing Technology XXIV
KEYWORDS: Polymers, Polymerization, Line width roughness, Palladium, Promethium, Immersion lithography, Line edge roughness, Photoresist processing, Semiconducting wafers, Polymer thin films

PROCEEDINGS ARTICLE | March 23, 2007
Proc. SPIE. 6519, Advances in Resist Materials and Processing Technology XXIV
KEYWORDS: Lithography, Polymers, Image processing, Molecules, Diffusion, Reflectivity, Image resolution, Extreme ultraviolet lithography, Line edge roughness, Photoresist processing

PROCEEDINGS ARTICLE | March 23, 2007
Proc. SPIE. 6519, Advances in Resist Materials and Processing Technology XXIV
KEYWORDS: Semiconductors, Lithography, Polymers, Silicon, Manufacturing, Photoresist materials, Immersion lithography, Fluorine, Semiconducting wafers, Polymer thin films

Showing 5 of 11 publications
SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Back to Top