PROCEEDINGS ARTICLE | May 9, 2005
Proc. SPIE. 5770, Advanced Sensor Technologies for Nondestructive Evaluation and Structural Health Monitoring
KEYWORDS: Imaging systems, Sensors, Sensor performance, Digital imaging, Structural health monitoring, Aluminum, System integration, Semiconducting wafers, Active sensors, Environmental sensing
A key question that needs to be addressed and answered with regard to successfully implementing Structural Health Monitoring technologies in Air Force systems involves the long-term operability, durability, and survivability of integrated sensor systems and their associated hardware. Whether a sensor system is fully integrated within a structural material, or surface-bonded to the structure, a number of environmental and system level influences will tend to degrade the sensor system’s performance and durability over time. In this effort, an initial sensor durability study was undertaken to better understand the performance and degradation of piezo wafer active sensor (PWAS) systems under adverse mechanical, temperature, and moisture conditions. A novel displacement-field imaging approach was utilized to understand the vibration characteristics of PWAS transducers placed in accelerated vibration, temperature-cycling, and moisture-cycling conditions. The results showed damage in the form of PWAS sensor cracking events, bond degradation and failure, as well as indications of performance variation and reduction due to the accelerated exposure levels. Future activities will focus on identifying critical durability and survivability issues through advanced sensor modeling and additional accelerated testing efforts, with the ultimate goal of improving the robustness of health monitoring systems through improved sensor system design and packaging.
