Mr. Jan Doise
at IMEC
SPIE Involvement:
Author
Publications (15)

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV
KEYWORDS: Optical lithography, Spectroscopy, Silicon, Chromium, Reactive ion etching, Semiconducting wafers, Scanning transmission electron microscopy

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10584, Novel Patterning Technologies 2018
KEYWORDS: Polymethylmethacrylate, Chemistry, Transmission electron microscopy, Tomography, 3D metrology, Directed self assembly, Picosecond phenomena, Semiconducting wafers, System on a chip, Scanning transmission electron microscopy

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV
KEYWORDS: Thin films, Lithography, Polymethylmethacrylate, Annealing, Directed self assembly, High volume manufacturing, Nanolithography, Thin film manufacturing, Resolution enhancement technologies, Temperature metrology

SPIE Journal Paper | August 21, 2017
JM3 Vol. 16 Issue 03
KEYWORDS: Directed self assembly, System on a chip, Picosecond phenomena, Polymethylmethacrylate, Optical lithography, Scanning electron microscopy, Polymers, Annealing, Semiconducting wafers, Lithography

SPIE Journal Paper | June 14, 2017
JM3 Vol. 16 Issue 02
KEYWORDS: Directed self assembly, Optical lithography, Immersion lithography, Photomasks, Integrated circuits, Lithography, Logic, Semiconducting wafers, Optical design, Optical proximity correction

PROCEEDINGS ARTICLE | March 27, 2017
Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV
KEYWORDS: Lithography, Optical lithography, Polymethylmethacrylate, Polymers, Annealing, Coating, Scanning electron microscopy, Directed self assembly, Picosecond phenomena, Thin film coatings, Semiconducting wafers, System on a chip

Showing 5 of 15 publications
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