Dr. Jason R. Grenier
at Corning Research & Development Corp
SPIE Involvement:
Author | Leadership Workshop Facilitator
Area of Expertise:
Ultrafast laser material processing , femtosecond laser microfabrication , Laser processing of glass , 3D waveguide inscription , Integrated optical circuits , co-packaged optics
Websites:
Profile Summary

Jason R. Grenier received the B.A.Sc. and M.A.Sc. degrees in electrical engineering from the University of Waterloo, Waterloo, ON, Canada and the Ph.D. degree in electrical engineering from the University of Toronto, ON, Canada, in 2016. His doctoral research focused on the ultrafast laser inscription of 3D optical circuits inside optical fibers. He has authored numerous publications and patents in the field of ultrafast laser material processing. Dr. Grenier joined Corning Research and Development Corporation in 2017 and his research interests include the field of 2D and 3D laser material processing to expand the frontiers of novel photonic devices and manufacturing processes


Career Interest/Objective
To advance fundamental understanding, provide technical leadership, and train the next generation of optical scientists & engineers in the field of ultrafast laser material processing, with the aim of developing state-of-the-art manufacturing processes that bring novel technologies to market
Publications (7)

Proceedings Article | 12 March 2024 Presentation + Paper
Proceedings Volume 12872, 1287203 (2024) https://doi.org/10.1117/12.3007998
KEYWORDS: Glasses, Refractive index, Augmented reality, Waveguides, Laser cutting, Laser processing

Proceedings Article | 11 March 2024 Presentation + Paper
Lars Brusberg, Lucas Yeary, Seong-ho Seok, JungHyun Noh, Jason Grenier, Betsy Johnson, Chad Terwilliger, Jeffrey Clark
Proceedings Volume 12892, 128920C (2024) https://doi.org/10.1117/12.2692092
KEYWORDS: Glasses, Connectors, Transceivers, Waveguides, Integrated optics, Interfaces, Design, Optical switching, Evanescence, Photonic glasses

Proceedings Article | 17 March 2023 Presentation + Paper
Jason Grenier, Andreas Gaab, Nicolai Haenel, Elisabeth Rosier
Proceedings Volume 12408, 124080A (2023) https://doi.org/10.1117/12.2653262
KEYWORDS: Glasses, Semiconducting wafers, Laser processing, Laser cutting, Laser applications, Wafer-level optics, Laser glasses, Wafer dicing, Metamaterials

Proceedings Article | 9 March 2023 Presentation
Proceedings Volume PC12427, PC1242707 (2023) https://doi.org/10.1117/12.2651387
KEYWORDS: Glasses, Optics manufacturing, Optoelectronics, Integrated optics, High volume manufacturing, Wafer-level optics, Ultrafast lasers, Signal processing, Semiconducting wafers, Packaging

Proceedings Article | 4 March 2022 Presentation + Paper
Proceedings Volume 11991, 1199109 (2022) https://doi.org/10.1117/12.2613420
KEYWORDS: Integrated optics, Glasses, Optics manufacturing, Waveguides, Optical circuits, Wafer-level optics, Polishing, Ultrafast lasers, Bessel beams, Laser processing, Laser cutting

Showing 5 of 7 publications
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