Jason Sweis
Customer Engagement Director at Cadence Design Systems Inc
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Publications (32)

PROCEEDINGS ARTICLE | April 10, 2018
Proc. SPIE. 10588, Design-Process-Technology Co-optimization for Manufacturability XII
KEYWORDS: Lithography, Data modeling, Manufacturing, Feature extraction, Design for manufacturing, Machine learning, Testing and analysis, Model-based design

PROCEEDINGS ARTICLE | March 20, 2018
Proc. SPIE. 10588, Design-Process-Technology Co-optimization for Manufacturability XII
KEYWORDS: Metrology, Inspection, Profiling, Photomasks, Image classification, Optical proximity correction, Algorithm development, Standards development, Resolution enhancement technologies, Classification systems

PROCEEDINGS ARTICLE | March 20, 2018
Proc. SPIE. 10588, Design-Process-Technology Co-optimization for Manufacturability XII
KEYWORDS: Multilayers, Databases, Error analysis, Silicon, Legal, Optical proximity correction, Tolerancing, Integrated circuit design, System on a chip, Intellectual property

PROCEEDINGS ARTICLE | March 30, 2017
Proc. SPIE. 10148, Design-Process-Technology Co-optimization for Manufacturability XI
KEYWORDS: Defect detection, Manufacturing, Diagnostics, Optical proximity correction, Structural design, Diagnostic tests, Semiconducting wafers, Failure analysis, Product engineering, Electrical breakdown

PROCEEDINGS ARTICLE | March 30, 2017
Proc. SPIE. 10148, Design-Process-Technology Co-optimization for Manufacturability XI
KEYWORDS: Roads, Statistical analysis, Databases, Manufacturing, Inspection, Control systems, Semiconductor manufacturing, Optical proximity correction, Structural design, Manufacturing equipment, Semiconducting wafers, Failure analysis, Product engineering, Plutonium, New and emerging technologies, Data analysis, Design for manufacturability

PROCEEDINGS ARTICLE | March 30, 2017
Proc. SPIE. 10148, Design-Process-Technology Co-optimization for Manufacturability XI
KEYWORDS: Defect detection, Silicon, Diagnostics, Data processing, Diagnostic tests, Semiconducting wafers, Signal detection, Failure analysis, Product engineering, Yield improvement, Electrical breakdown, Process engineering

Showing 5 of 32 publications
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