Dr. Jassem Abdallah
at
Area of Expertise:
Photolithography , Directed Self Assembly , Process Engineering , Patterning , CMOS Processing , Process Development
Profile Summary

I am interested in microfabrication and advanced patterning of CMOS structures, functional materials, and process development. I have extensive experience CMOS processing and process development of functional materials for electronic applications. During my second post-doctoral assignment, at IBM, I used 193 nm photolithography, reactive ion etching (RIE), and directed self assembly (DSA) of (PS-b-PMMA) block copolymers, tools to create high density line/space and via structures on 300 mm silicon wafers using high volume manufacturing tools. I evaluated pattern quality using CD-SEMs and cross-section SEMs, and assessed the overall manufacturability of different patterning schemes based on chemi-epitaxy DSA and grapho-epitaxy DSA process flows. The DSA work resulted in multiple publications and invention disclosures related to the high volume manufacture of high density CMOS features. For a separate structural build patterning project, I used sidewall-image transfer (SIT) in conjunction with pitch split patterning to create fully integrated CMOS structures through all FEOL, MOL, and BEOL patterning levels.

During my first post-doctoral assignment, at the Georgia Institute of Technology, I used spectroscopic analyses, thin film characterization, and thermal analyses to I investigate the intrinsic properties of functionalized polymers and small molecules for organic light emitting diodes (OLEDs) and organic photovoltaic systems (OPVs). I investigated the morphology of electro-active films, and optimized processing schemes for research-scale fabrication of organic electronic devices using the functional materials. Additionally, I evaluated several silane-based and phosphonic acid-based surface modifiers in promoting wetting and adhesion on silicon and indium-tin-oxide (ITO) substrates. Additionally, I formulated UV-crosslinkable and thermally-crosslinkable solutions for use in building multi-layered OLED stacks using wet-deposition methods only.
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